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We report a compact 1×8 silicon Mux/DeMux with ring tuning efficiency of <3µW/GHz using back-side substrate removal technique. Total power of <4.1mW was measured to tune the device to a 1.6nm wavelength grid.
We report an ultra-low power 100Gbps silicon photonic WDM transmitter tunable with off-chip laser sources. The hybrid CMOS transmitter consists of eight 12.6Gbps WDM channels and consumes a total on-chip power of 33mW.
We report a complete 10Gbps digital CMOS photonic direct chip-to-chip link. The link includes power supply regulation and digital retiming and uses record-low 680 fJ/bit transceivers and an optical power of 1.4 pJ/bit.
We report a 25Gb/s ring modulator with integrated thermal tuning fabricated in a 130nm CMOS process. With 2Vpp modulation, the optical eye shows >6dB extinction ratio. Modulation energy is estimated <24fJ/bit from circuit modeling.
We report an ultra-low power 80 Gbps arrayed silicon photonic transceiver for dense, large bandwidth inter/intra-chip interconnects. The hybrid CMOS transceiver consists of eight 10 Gbps WDM channels with total consumed power below 6 mW/channel.
We present add-drop filters manufactured as ring resonators in commercial 130 nm SOI CMOS technology with thermal tuning. Their thermal impedance has been dramatically increased by the selective removal of the substrate resulting in a 20,12× increase in tuning efficiency for 100, 30 micron radius device.
We present ultra low power silicon photonic transceivers, including a 320 fJ/bit reverse biased ring modulator integrated with CMOS driver, and a 690 fJ/bit record-low power receiver with sensitivity of -18.9 dBm at 5 Gbps for bit-error-rate of 10-12.
We report a 320 fJ/bit transmitter made of a Si microring modulator flip-chip bonded to a CMOS driver. The transmitter consumes only 1.6 mW power, and exhibits a wide open eye with extinction ratio >7 dB at 5 Gb/s.
In this paper microchip technology was explored. In order to scale chip-to-chip I/O to the required communication performance and energy, optical interconnects between chips based on CMOS-compatible silicon photonics was proposed. One key component is an inter-chip optical coupler supporting wavelength-division multiplexing (WDM) functionality that enables face-to-face optical proximity communication...
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