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Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
This paper represents 3-dimensional crossing structures of multimode polymer optical waveguide with graded-index (GI) circular cores for optical printed circuit boards (OPCBs), which are fabricated using the Mosquito Method. In this waveguide, the cores are aligned with a 250-pm inter-channel pitch containing both horizontally and vertically bent structures, where the last 6 channels are crossing...
2.1D package technology (chip on substrate) as a potential low cost solution for 2.5D silicon interposer package (chip on wafer on substrate), we develop here a panel type manufacture organic interposer (scheme 1). 2.1D technology focus on the production cost and the ball count range which defined by line/space. We presents the demonstration of high resolution photolithography semi-additive processes...
Circular-core single-mode polymer waveguides with a graded-index profile were designed and fabricated using the Mosquito method. Their optical characteristics and high speed performance were evaluated with a data rate of 25 Gb/s at 1550 nm.
Utilizing hydrogen radicals as a reducing agent, reflow of indium solder paste printed on chips were conducted. Where hydrogen gas treatment failed to form indium solder bumps at 250 C, it was shown indium solder bumps were successfully formed at temperatures as low as 170 C.
To realize free optical wiring patterns on printed circuit boards (PCBs), polymer shuffling optical waveguides are fabricated, in which both crossing and curved core structures are combined. The obtained GI polymer shuffling waveguides show low insertion loss independent of the crossing angle and core size. The GI-core polymer shuffling waveguide is a key device for low loss and high density on-board...
As line rates in data centers increase to 25 Gb/s and higher, system architects are seeking solutions to overcome signal integrity issues due to the long electrical traces that require retiming. In addition, the density of interconnects on the front panel is limited by the size and power dissipation requirements of the pluggable modules. One proposal to alleviate these issues is to use embedded optical...
This paper reviews recent advances in high speed short reach optical interconnects for Datacom links from the perspective of Ethernet applications, fiber development and system experiments based on the multimode-VCSEL paradigm.
Heat pipe is a best known passive cooling & heating device which is excellent in heat transfer and low thermal resistance. Basically, heat pipe is a two-phase heat transfer device using latent heat. Heat pipe is a device of very high thermal conductance and its equivalent thermal conductivity can be several hundred times higher than that of a solid copper rod of the same dimensions. Currently,...
A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat...
This work proposes a broadband microstrip patch antenna array with H-shaped aperture-coupled stacked rectangular patches is implemented to low-cost and low-loss organic substrate for flip chip chip scale (FCCSP) package for millimeter-wave antenna in package (AiP) application. The proposed antenna array is built on a low-cost and low-loss multilayer organic substrate for flip chip chip scale (FCCSP)...
Fan-Out Panel Level Package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor, large-area processability and manufacturing cost. However, they typically require us many unique and novel equipment and thus enormous initial cost tremendously. Here we report new FOPLP manufacturing processes involving single-sided adhesive tapes....
We have designed, fabricated and tested edge couplers for silicon photonics targeting industry-standard SMF-28 fibers. These edge couplers are based on a SiN inverse taper fabricated on a silicon-on-insulator (SOI) platform combined with an etch-based substrate removal process that prevents leakage of the expanded mode to the underlying silicon substrate. The measured couplers exhibited a 0.5 dB bandwidth...
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