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This paper reports optical fibers for low-loss coupling with silicon photonic circuits. We fabricate both singlemode fibers and polarization-maintaining fibers with a mode field diameter of 4 pm for matching with an edge coupler. We demonstrate fusion splicing with standard transmission fibers and optical coupling with silicon photonic devices. Low-loss splicing is achieved by utilizing the thermally...
The small-cell base station requires a high linearity, high reliable and high efficiency power amplifier to enhance signal strength in a coverage region. To meet the demand, the 2.6 GHz two-way symmetrical Doherty power amplifier module which uses modularized components, enhances system stability and integrates with heat sink is proposed. The experimental results show that the proposed module delivers...
A switchable tunable dual-band filter using varator diodes for band switching and frequency tuning is proposed. The tuning range of first band is from 2.3 to 2.8 GHz and second one is from 1.8 to 2.1 GHz. The proposed dual-band filter is composed of two second-order Chebyshev short-ended hairpin comb filters which embedded a pair of the varators as a switching and tuning elements. The simulated and...
A fully integrated 24.5/35-GHz dual-band T/R/Calibration switch module with Q-enhanced filtering function for a concurrent dual-band phased array system is presented. The proposed T/R/Calibration switch module offers internal calibration function with a quasi-elliptic dual-bandpass filtering which is enabled by a Q-enhanced metamaterial transmission line structure. This switch module architecture...
We demonstrate a 28-Gb/s × 24-channel on-board optical transceiver operated under an air-cooling environment. The optical transceiver realizes a data rate density as high as 1.34 Tb/s/inch2 with a total power consumption of 9.1 W. A unique packaging structure of the transceiver enables using the whole top surface for thermal dissipation by the aid of air-cooling heatsink. The optical module realizes...
Downsizing the Cu signal traces in the redistribution layer is an effective approach to increasing the number of signal I/O lines and thereby greatly increasing signal processing performance between logic and memory chips in advanced fine-pitch packaging. Downsized Cu traces, however, are vulnerable to current stress, which degrades electromigration resistance. This is a serious problem in advanced...
Polymer waveguide based hybrid photonic technology allows for integration of lasers, receivers, wavelength splitters/combiners, polarization-handling elements, and several other optical functionalities. An overview of HHI's Poly Board photonic integration platform is given, showing its potential for various application fields such as telecom/datacom, sensing, and active optical printed circuit boards.
This paper demonstrates that our very thin film STO capacitor can be located under re-distribution layer (RDL) of WLP/FO-WLP package and is effective for reduction of the power supply noise of LSIs. Their Shmoo plots show improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our Sub-RDL STO thin film capacitors.
This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength,...
Polymer waveguides incorporated with europium (Eu)-aluminum (Al) polymer composite are fabricated by applying the Mosquito method. The optical amplification gains of the fabricated waveguides with different lengths are measured under a coaxial pumping condition. It is found that the pumping efficiency tends to decrease with increasing the waveguide length. In order to improve the efficiency, the core...
High thermal conductive adhesive is important to cool power devices. Recently thermal conductivity reaches more than 10W/mK by efficient addition of thermal conductive filler. However, high loading of filler makes the thermal conductive sheet poor adhesion. Furthermore, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive...
SiC devices are expected to be used in high voltage fields that require a breakdown voltage from 3 to 10kV such as railways, as well as the automotive that require high reliability such as hybrid vehicles and electric vehicles. This paper presents the packaging technologies of enhanced breakdown voltage for All-SiC modules.
In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula that can be used for temperature estimation for densely mounted components was derived.
We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit...
In this paper the CEA LETI proposes a silicon test vehicle and method to quantify the degradation of packaging in a biological medium. Those developments are suited for medicals devices which are potentially in contact with human cells. Different solutions of encapsulation, performed at the wafer level in clean room, are presented and compared. Test vehicles were made on silicon wafer including AlSi,...
This paper introduces a thermal design method for 3D integration, using stacked thermal chips consisting of 100 polysilicon heaters in a 30 mm by 30 mm area on each chip to verify thermal models. For each heater, two levels of thermal load can be selected. Thermal effects from hot-spots in stacked chips were measured and verified in simulation results. Through this investigation, thermal models with...
This paper describes a thermal design method of printing process in printers that a lot of electrical components are mounted and the structure in the inside becomes complex because miniaturization and more additional functions are strongly demanded. Most of printing methods such as a laser printing and a thermal printing use heat in order to do the printing. In order to increase a reliability of the...
This paper reports on a large-size CPU package for UNIX servers which employs embedded thin film capacitor layers. The substrate of this package has two thin film capacitor layers in the surface of the core layer, which has a capacitance of 25 uF in total. In order to adopt this package substrate, we confirmed the effect of the thin film capacitor layers on the package assembly process. We actually...
With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
Recently, the importance of the optical fiber is increasing particularly in sensing application. Thus, this paper proposes optical sensing by exposed core fiber technology using Self-Written Waveguide (SWW) method. SWW method is fabrication of an optical channel waveguide using a UV-curable resin. As a UV light irradiated, A SWW with length of 800 micrometers is aligned between two fibers from the...
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