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Currently, optically reconfigurable gate arrays have been being developed for space radiation environment applications. An optically reconfigurable gate array consists of a holographic memory, a laser array, and an optically reconfigurable gate array VLSI. The optically reconfigurable gate array is a type of field programmable gate arrays (FPGAs). The radiation tolerance of the optically reconfigurable...
L-CRIGF consists of a grating coupler in a waveguide cavity. Four tandem L-CRIGFs of different wavelengths were designed and fabricated. Wavelength selective reflections and simultaneous couplings to a single output waveguide were confirmed experimentally.
The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is a very important technology for next generation communication devices and internet of things (IoT) applications. Recently, integrated fan out wafer-level...
The fact that Sn-Cu reaction rate is much faster than Sn-Ni reaction and releasing much more gibbs free energy causing Sn prefers to have reaction with Cu instead of Ni. Moreover, at the temperature below 170°C, Sn side-wall reaction rate is larger than IMC formation rate at the temperature below 200 °C because the long distance Sn side-wall migration is faster than Cu traveling through to center...
This paper proposes a fully integrated 5–12 GHz power mixer in tsmcTM 1P6M 0.18 μm CMOS technology. The power mixer is used to replace the conventional mixer and power amplifier (PA). The circuit consists of an up-conversion Gilbertcell mixer and a wideband and low loss 1:4 Guanella-type differential transmission-line-transformer (DTLT). The power mixer is biased at deep class A/B under a 3.5-V supply...
A compact narrow-band low temperature co-fíred ceramic (LTCC) filter with a fractional bandwidth of 3% is proposed. The proposed filter consists of five cascaded half-wavelength resonators vertically arrayed on each LTCC layer. End-coupling between adjacent resonators is precisely controlled by rectangle-shaped slot on intermediate ground layer. The overall size of the filter is only 8 × 6 × 0.89...
In this paper, a wideband bandpass filter (BPF) with very compact circuit size is proposed. Specifically, the circuit size of a 5th-order multi-mode resonator BPF is largely reduced by replacing all transmission line sections with bridged-T coils. The resulted lumped-element BPF can then be implemented using the integrated passive device technology to achieve very compact chip size. To improve also...
Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says...
A Full 25GB/S silicon photonics platform is described in this paper, and new technological challenges that aim to improve this platform, such as multiple silicon levels, silicon nitride levels, edge coupling processing or integration of heterogeneous materials to enable tunable integrated lasers, are discussed.
Drop test for solder joint reliability is critical for all area arrays and perimeter-leaded surface mount semiconductor devices typically used in handheld electronic products. Joint Electron Device Engineering Council, JEDEC, published a new test standard, JESD22-B111A, to be the revision of the JESD22-B111 for board level drop test in November, 2016. The major differences between JESD22-B111 and...
The presence of common-mode noise in differential lines is a major contributor to signal integrity problems in high-speed digital systems. Common-mode noise is typically excited by skew. It can occur due to timing mismatches at the driver, length mismatches due to routing constraints, or phase velocity mismatches due to inhomogeneous dielectrics with fiber-weave effect. Common mode noise results in...
We propose a built-in test circuit to detect resistive open defects occurring at interconnects between dies of 3D ICs. The test circuit consists of an I-V converter and a comparator of offset cancellation type. Feasibility of the tests with the circuit is examined by SPICE simulation. It is shown that resistive open defects of 5Ω and above can be detected per 240nsec under process variations of MOSs...
In our previous study, we argued that stabilization of power source voltage by optimizing a chip wiring feature was essential to achieving high performance transmission for over 40 Gbps I/O on an interface circuit. This region frequency transmission approach is fairly important to solve communication bottleneck. We will examine power supply wiring for more high frequency (over 40 Gbps) which is significant...
Presents the introductory welcome message from the conference proceedings. May include the conference officers' congratulations to all involved with the conference event and publication of the proceedings record.
This paper describes an EM (electromigration) mechanism on interconnected Cu pillar in flip chip package. It will be clarified that the EM life depends on Cu pillar interconnection structure. Recently, it was reported that the EM life was deteriorated by applying ENEPIG (electroless Ni-P/Pd/Au) plating layers on a substrate pad used for solder connection [1]. It was because Ni diffusion into solder...
Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature significantly enhanced deformation of the Cu FAB while the application of pressing load and ultrasonic...
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