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In this paper, an investigation on the reliability issues of the packages for high temperature applications is presented. First, experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was...
This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical...
Thin metal films are widely used in modern electro mechanical systems. The need for more integrated functionality and minimization of material and energy consumption leads to miniaturization of these systems. As a consequence, materials are processed on the micro- and nanometer scale. On this scale, material properties become a function of size. To predict performance and reliability, knowledge on...
In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects...
A mechanistic multiscale modeling framework is proposed, to capture the dominant creep mechanisms and the influence of key microstructural features on the measured secondary creep response of microscale as fabricated Sn3.0Ag0.5Cu (SAC305) solder interconnects. At the smallest length scale, mechanistic dislocation creep models are used to capture the creep strengthening mechanisms in the Sn-Ag eutectic...
This study presents a method to predict lifetime of SMD lead free solder joints submitted to vibrations. An experimental method is presented to test chip resistors under vibrations. A specially designed testboard allows testing several specimens simultaneously. The time to failure is electrically detected. The experimental method is simulated using the Finite Element Method (FEM) in order to correlate...
In the 1960's surface mounted technology was developed. This technology as an alternative for through-hole technology made it easier to place components on both sides of the board by soldering, decreased package sizes, simplified assembly and reduced costs. Furthermore, higher mechanical robustness was obtained. In this paper, a numerical-experimental study is performed to investigate the robustness...
Current paper focuses on the influence of carbon nanotube (CNT) length on its thermal conductivity. The powerful technique which is molecular modeling was used. The non-equilibrium molecular dynamics was implemented in commercially available software. The eight single-walled carbon nanotubes from 50 nm to 400 nm was investigated. The obtained results show the trend of increasing thermal conductivity...
Due to the increase of microelectronic assemblies' complexity, the use of FEM simulations has become inescapable either for reliability prediction, or for virtual prototyping or qualification. This article will first describe the main reliability challenges linked to harsher environmental stresses, to new materials, to third dimension. Some examples taken from the current IMS lab studies, will illustrate...
Since the 1990's, computational fluid dynamics (CFD) has been widely adopted in the electronics industry for the thermal design of electronic products. Its advantages in terms of product improvements and enhanced productivity of design analysis, are undisputed. However, the industry has also experienced that incorrect product design decisions can be taken as a result of inaccurate CFD predictions,...
Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are key to accelerated lifetime testing, are becoming to...
Single-phase liquid cooling is increasingly being deployed to cool high power, high heat flux electronic components such as microprocessors. In a conventional liquid cooling loop, the primary heat exchanger represents a key design challenge as this is typically subject to stringent constraints on footprint area and profile. This paper presents some experimental findings for two classes of flows of...
Miniaturization and increasing functional integration as the electronic industry drives push the development of feature sizes down to the nanometer range. Moreover, harsh operational conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k materials in Back-end of line (BEoL) layers of advanced CMOS technologies, in particular -...
Wireless capsule endoscopy, as an outstanding application of Microelectronics and MEMS technology, provides a promising approach to acquire images of the gastrointestinal tract. Technological challenges for the next generation of endoscopic devices include reducing component size, improving power management, and introducing active locomotion control. This paper describes a novel solution in the endeavor...
The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to...
An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning...
The main objective of this study is to validate the thermomechanical properties of materials used in some electronic components. The improved performance of HgCdTe infrared focal plane arrays requires reliability of the assembly at low temperatures down to 77K. Unfortunately, the thermomechanical behavior of most materials of these components remains to be clarified, particularly in a cryogenic environment...
The aims of this study are to estimate the effect of geometrical dimensions on stiffness, stress and strain of flexible MEMS structures at pull-in and stiction positions. Microcantilevers and microbridges are often used as flexible mechanical elements in microsystems for sensing and actuation functions. Analytical models for stiffness, stress and strain of flexible microcomponents as microcantilevers...
Atomic-scale computational materials engineering offers an exciting complement to experimental observations, revealing critical materials property data, and providing understanding which can form the basis for innovation. This contribution reviews the current state of atomic-scale simulations and their capabilities to predict mechanical, thermal, and electric properties of microelectronics materials...
Light-emitting diode (LED), generally used for indicator light, has been developed for the past 50 years. Recently, LED has attracted many industries in the research and design of their products. However, its low electro-optical conversion efficiency causes redundant heat leading to increased junction temperature and decreased LED luminosity. In this research, a detailed finite element method (FEM)...
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