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This paper analyzes a pioneering topic in the telecommunications field: how preserving the signal integrity in all-optical ultra-fast signal processing boards with optical interconnects and Semiconductor Optical Amplifiers (SOAs), probably the most well-known active devices used in the Optical Time Domain Multiplexing systems (OTDM). In particular, it investigates the performances of an attractive...
In this paper we discuss a computational framework which allows for accuracy controlled capacitance extraction in the entire package model consisting of 2.9 million elements on the conductor boundaries. The capacity for simulation of large- scale interconnects is attained through parallel implementation of a tree-based hierarchical computational algorithm. The acceleration of dense matrix-vector product...
Vias in printed circuit boards and chip packages are known to have significant detrimental impact on signal and power integrity in high-speed communication systems. Recently, concise equivalent circuit models for vias in multilayer configurations have been explored by the authors. The models accurately reflect the important physical properties of vias, since the topology utilized has a one-to-one...
In the long-distance telecom, local-area, and rack-to-rack link classes, optical interconnects have gradually replaced electrical interconnects. We believe that this trend will be continued in the short-distance card-backplane-card datacom link class. Convincing arguments for the predicted transition from electrical to optical interconnects are bandwidth-length advantages, density benefits, crosstalk...
Accurate modelling of signal propagation on optical interconnects is very important to improve and speed up the progress of integrating optical interconnections into the conventional manufacturing process of electrical-optical layouts. In this paper a model is introduced which represents the coupling of optical power from a laser diode into a dielectric waveguide with a rectangular cross section....
In this presentation we overview the multi-discipline low power platform architecture and where improvements were made, we will show examples of low power innovations in process technology, microprocessor design, IO signaling and IO power delivery subsystems. We will show these innovations and techniques resulted in energy efficient mobile computing to the end user. We will end the presentation with...
The following topics are dealt with: on-chip interconnects; transmission lines and high-speed channels; macromodeling by vector fitting; linear macromodeling; interconnect characterization; optical interconnects; 3D modeling; packaging and power integrity; interconnect modeling and analysis; chip, packaging and material issues.
Process variations can have a significant impact on both device and interconnect performance in deep submicron (DSM) technologies. In this paper, authors discuss the impact of process parameter variations on bus-encoding schemes for delay minimization. It is shown that if process variability is taken into consideration, there will be a change in effective capacitance (Ceff) of the bus lines because...
This paper presents the coupling effects of multiple bent interconnects separated by an internal angle. The method of moments with pulse basis function and point-matching has been used for the modeling of the wires. The mutual impedance of the bent interconnects has been characterized in a wide range of frequencies. From the studies of different bent structures it has been found that the right angle...
Today the telecommunication equipments are characterized by transmission bandwidths of tents of GHz. Consequently the digital signals into play reach data rates of some Gbps with rise/fall times of few picoseconds. In this context it is important to correctly characterize the transmission lines on boards for studying the signal propagation as a function of the frequency. The more effective technique...
For deep submicron (DSM) interconnects on-chip inductive effects are rising due to increasing clock speeds, decreasing interconnect lengths and signal rise times are the major concern for signal integrity and overall interconnect performance. Inductance causes noise in the signal waveforms, which can adversely affect the performance of the circuit and signal integrity. For global wires inductance...
We measured the differential insertion loss and the deterministic jitter for three types of differential transmission lines on a motherboard in a serial backplane bus at 2 Gbps in order to prioritize the design specifications for transmission lines. We tested three line widths having different common impedances of the lines while keeping the differential impedance at about 100 Omega, moreover varied...
The signal integrity of VLSI circuits is an emerging concern in high performance integrated circuits. A previous RLC crosstalk noise expression we have submitted, based on a RLC transmission line model associated with each propagation mode, could predict the noise amplitude of an RLC interconnect, yet only by making the assumption of a perfect symmetry between the two coupled lines and their respective...
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