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Within the last years a constant increase of application temperatures for electronic packaging is observable, this is true for sensor applications, for power electronics packages and also for Smart Power Modules, integrating control logic and power ICs in one compact package. Drivers for HT use are on the one hand the introduction of GaN/SiC power electronic devices; these need modules to operate...
The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. The functionalization of a catheter depends on different influence factors. The form factor takes the most important role...
Radio frequency identification (RFID) tags are typically used for object identification in environments in which they are not exposed to very harsh conditions. However, there is an increasing demand for inexpensive RFID tags for use in harsh industrial environments, but the adequate performance of the materials used in them needs to be verified in such conditions. This paper reports the reliability...
Solder joint crack in thermal cycling on board (TCoB) for surface mount devices (SMD) is becoming more stringent in semiconductor market. Current TCoB literature mainly focuses on Finite Element Analysis simulation with ANSYS software to identify the most sensitive parameters affecting TCoB performance and estimating the solder fatigue life. By a given Driver Mosfet Power QFN, this paper is focusing...
Under the new technical condition, the promotion of equipment complexity and high-tech features makes a significant increase in the workload of equipment support. Commands of support organizations become more complex. In order to meet these demands, the equipment support system has gradually evolved to the network structure. Network-centric equipment support system will become the development trend...
Silver-based low temperature sintering technology (LTST) is becoming a promising alternative to bond or joint the large area joints as die attach for high temperature power modules. A review of the silver-sintered die attach technologies will be presented in this paper, as well as a roadmap of challenge of the state-of-the-art silver sintering. Then, highlighted are the methodology of sintering process,...
In this paper, the main failure modes and mechanisms were investigated through some failure analysis cases, based on this, Subsequent 160°C, 170°C and180°C lifetime tests were completed. According to the method of least squares, the degradation model of high power light emitting diodes is obtained. Using the model and ALTA9 software, the extrapolated lifetime of high power light emitting diode at...
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the use of Copper (Cu) wire as an alternative...
A PHM (prognostics and health management) scheme for electronic product is proposed on the basis of physics-of-failure. This method can help online reliability evaluation under real environmental condition by the identification of potential failure mechanism and failure position for devices, products and systems, so as to establish the foundation of reliability assessment for new material, new structure...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
Lead-free solder alloys are more easily oxygenized and have poor wettability compared to traditional Sn-Pb solder alloys, which affects solder joints reliability. Ar is the most plentiful rare inert gas. It has been accepted that, in Ar atmosphere, the oxidation of lead-free solder joints can be prevented and the wettability of lead-free solder joints can be improved. To date, however, few systemic...
Photovoltaic modules have been operating in the outdoor environment for more than 30 years now. These modules have been exposed to a wide range of stresses including UV and visible radiation, high and low temperatures, seasonal and diurnal temperature variations, internal electric field, localized heat, moisture including rain, humidity and condensation, abrasion and other mechanical stresses. Over...
HVDC transmission systems are being employed in many projects all over the world. In particular, the demand for long-distance HVDC power transmission lines is increasing to interconnect power grids between main land and island or wind farm grid connection. With such an increasing demand, it was required to develop new insulation materials suitable for the DC cables. The extruded insulation material...
Interconnect-related problems in the advanced technology node are identified and possible solutions are proposed. A PVD process of a double-layer Ta/TaN barrier is to be replaced with a CVD process of a single-layer barrier. Cu filling process can be changed from PVD seed deposition and electroplating to dynamic PVD reflow of Cu. Manganese and its oxide are shown as a possible choice of new barrier...
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