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The further miniaturization of electronic devices brings the challenge to the electronic packaging, especially for 3D interconnection as the miscrostructure of the solder joint could be replaced by IMC fully without any solder bulk remain. In this paper, both FE modeling and experimental testing were applied to investigate the stress distribution and the fracture mode of the solder joint under tensile...
The hysteretic nature of the filamentary electron transport in MIM/MIS resistive switching devices is modeled within the framework of the Landauer theory for mesoscopic conductors. It is shown that a two-equation system, one equation for the current-voltage (I–V) characteristic of a nano-sized constriction and a second equation for the time dependence of the confining potential yield the wide variety...
We developed the new control gate (CG) material and structure in order to overcome scaling limitation beyond 20nm NAND flash cell. New CG material can achieve excellent gap-fill without void and improvement of the Gate CD Gap (GCG). And also, by using new CG material, CG depletion between floating gate (FG) can be improved. As a result, gate coupling ratio, bit-line (BL) interference and tail-cell...
During the past decade, the teachers in the schools have increased their use of Internet-based content and resources in their classrooms. The blended approach combines the best elements of online and face-to-face learning. Blended learning is booming as the education becomes more demand-focused. This paper briefly explains about a system which supports to educate the children in a blundered learning...
The next review of exemption 8(e) about lead in high melting temperature type solders (i.e. lead based alloys containing 85% by weight or more lead) will be take place in 2014. An alternative to lead base alloy has to be defined before this dead line in order to comply with lead free regulation for automotive high power electronics. Lead free soldering is known to generate more voids than the current...
The R&M performance of a system is usually measured in terms of its Reliability (Ro), Availability (Ao), and Maintainability (MTTR and DMC) During the design phase of a system, several choices need to be made, such as number of redundant modules required to achieve a desired performance level (Reliability, Availability etc.), the system configuration or architecture, performance specifications...
In order to investigate the effect of the bonding parameters on the reliability of Al heavy wire bonds, samples were bonded with three different ultrasonic power levels and three different bonding force levels. The samples were exposed to active power cycling with a temperature swing of 120K (measured at the chip center). Each wire bond??s individual temperature swing was determined by IR thermography...
This paper compares two different approaches to estimate the reliability of mechanical components subject to degradation (wear, fatigue, etc.). This estimate is realized by considering the degradation drift (periodic or continuous measurement of the degradation level) from tests or exploitation. Two approaches are presented in this article. The first approach is based on a deterministic mechanical...
Quite a few tasks focusing on failures of electronic components caused by vibrations have shown that a satisfactory depth of problem analysis cannot be achieved with existing problem-solving methods. Thus, new options supported by computing power have been investigated which make evaluating the stress and reliability of electronic components subject to vibrations faster and more reliable. The paper...
In this paper, a series of x-ray coherent scatter images have been simulated with the Gaussian distribution theory. The traditional method and the Multi-resolution measure were taken to extract the spectrum curve from images. The comparative results of two methods show that the Multi-resolution is an effective, simple, reliable measure. It confirms the application of Multi-resolution in coherent scatter...
The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally...
This paper will highlight some of the recent advancements in 300mm eWLB wafer development. Compared to 200mm case, 300mm eWLB wafer has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100∼150% more warpage with 300mm eWLB wafer compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness,...
In this study, the vibration reliability at elevated temperature was evaluated on Pb-free solders (Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb). Daisy-chained BGA chips with ENIG finish was assembled on FR-4 PCB with OSP finish. After fabrication of test modules, vibration test was performed under resonant frequency with acceleration of 3G-level at 150°C. To understand the difference of reliability among three...
Reliability of palladium coated copper wire is believed to have enhancement over bare copper wire. With current understanding, the main failure mode in copper wire bonding is galvanic corrosion of the less stable Cu9Al4 intermetallic compound (IMC) phase in the highly accelerated stress test (HAST). In gold wire bonding, palladium (Pd) is known to retard formation of the corrosive prone Au4Al phase,...
Copper (Cu) wire development started in the early 1980's as the cost for semiconductor manufacturing has become competitive and challenging with the increase of gold price. The lessons learned along the research and studies carried out, helped the industry to understand the subtleties and facts about Cu wire bonding process. The most common and important facts about Cu wire bonding is its sensitivity...
The industry has traditionally maintained an average 15% cost down per year per function over the range of products it offers. Part of this reduction comes from packaging where manufacturing efficiencies such as cycle time reduction. supply chain management, and yield improvement allow for continued reductions in the cost per I/O. As the leaded package families are expected to increase in volume,...
Delamination remains a major problem for the reliability of semiconductor components. It is typically addressed with temperature cycling tests, which are rather time-consuming. The paper presents an approach to provide data for material selection in the early development phase based on adhesion measurements and simulation. The approach provides an improved base for decision and allows to reduce development...
Course outcomes (CO) or course learning outcomes is a practice used as a method of assessment on accumulated knowledge, skills, or attitudes gained in a learning process. A clear set of final learning expectations usually exposed to students at the beginning of the course and these expectations should be correlated to assessment methods. However, assessments of the achievement of course outcomes usually...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of...
The project VISA (German abbreviation of “fully integrated power electronic systems for automotive electronics”) gives an answer to future challenges to electronic printed circuit boards in automotive applications. VISA was a three year funded project by the Federal Ministry for Education and Research. The i² Board concept, developed by Schweizer Electronic was investigated for automotive application...
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