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The goal of this paper is to review generator systems used in wind turbines and to determine suitable generator concepts for future high power wind turbines. An up to date state of the art of wind turbine generators is first presented. It will help, through a critical analysis, to identify limiting constraints to power rating increase of wind turbine generator systems. Finally, some potential solutions...
The aim of this study was to check the load resistance factored design (LRFD) codes for Korean softwood species. Three representative structural timber Lazix Kaempferi, Pinus koraiensis, and Pinus densiflora, in the northeastern South Korea were selected. For evaluating the bending strength, a full-sized specimen was used. In the test results, it seemed that the KFRI grading rule was suitable for...
Solder Joint Reliability (SJR) is the ability of solder joints to remain in conformance to their visual, mechanical and electrical specifications over a given period of time, under a specified set of operating conditions. There are various accelerated tests that can be performed to assess this. The focus of this research paper is confined to Electromigration, Thermal Migration and Temperature Cycling...
There is growing interest in longer-term operation of the current US nuclear power plant (NPP) fleet. This paper presents an overview of prognostic health management (PHM) technologies that could play a role in the safe and effective operation of nuclear power plants during extended life. A case study in prognostics for materials degradation assessment, using laboratory-scale measurements, is briefly...
To support development processes for nanodevices, we want to utilize the information related to experiments from nanodevice development research papers. In this paper, we propose a new guideline for constructing a tagged corpus of nanodevice development papers to achieve this goal. We also propose the use of a corpus construction support tool. To speed up the construction process, we propose an approach...
An and model was used to establish the constitutive equation of SnAgCu solder, the stress-strain response of soldered joints was analyzed by finite element code. Results indicated that the stress concentrates on the sharp corner of interior part of outermost soldered joint, where is the weakest position at which cracks initiation take place easily and lead to failure owing to thermal fatigue finally...
In this thesis, electrochemical corrosion and electrochemical migration characteristics of 64Sn-35Bi-1Ag (SBA) solder with In doping in 3wt.% NaCl solution are researched by potentiodynamic polarization measurement and a self-designed experiment, respectively. The surface morphology and elemental composition of corrosive products and dendrites during ECM process are determined by SEM, EDAX techniques...
To secure the reliability of lead free solder is a critical problem for microelectronics packaging. The drop test is used to characterize the reliability of the soldered assemblies. Numerical simulation techniques are popularly used for such tests to reduce the cost. A proper working combination of the damage criterion and the numerical simulation to predict fatigue life is still an unsolved problem...
As the market is desperate for better performed, miniaturized, highreliableand lower-priced electronic devices, nowadays, three dimensional integrated circuit (3D IC) seems to be a promising technology which can meet these requirements. However, many issues hinder this technology from being developedrapidly, among which the reliability of through silicon via(TSV) is one of the major concerns. Because...
As a result of increasing gold (Au) price, the use of copper (Cu) bonding wire has gained popularity for mass production. The different properties in hardness, oxidation and electrochemical potential between Au and Cu have a significant impact on the wire bonding process and reliability. This paper focuses on the oxidation and corrosion of Au/Al and Cu/Al ball bond for the wire bonding processes and...
High power laser diodes have found wide spread applications as pump sources for solid state lasers or in direct material processing. Due to the high electrical and optical power densities in the laser structures the reliability is still questionable. We report on lifetime testing of a high power cm-bar arrays using an automated diode array reliability experiment. This computer controlled setup operates...
Linear elastic fracture mechanics (LEFM) approach was used for studying the influence of the interfacial IMC layer thickness and solder mask layer thickness on fracture behavior of ball grid array (BGA) structure solder interconnects using finite element numerical simulation. The stress intensity factors (SIFs, KI and KII) at the crack tip of a predefined face-crack in the IMC layer of BGA joints...
Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.
During the past ten years, fan-in wafer-level chip scale packages (WLCSPs) have extended its application into most of the portable handheld electronic devices, such as smart phones and tablets. All the applications of fan-in WLCSP were limited to devices with smaller die size and lower pin counts. Recently, some new applications with advanced silicon technology nodes impose new challenges on fan-in...
In- and out-doors LED is a new device with excellent performance in power-saving, lighting efficiency, reaction time. Currently, it is widely used in communication, display, illumination. Reliability is a key point to promote its application. The most important reliability issue in LED modules is about packaging which includes refrigeration, bonding wire, the aging of organic material, good packaging...
Interfacial delamination between molding compound (MC) and die pad interface is the most crucial failure mechanism of exposed pad package under reliability testing due to high interfacial stress and weak adhesion strength. A combined interfacial adhesion characterization, JEDEC Moisture Sensitivity Level 3 and 3X IR reflows qualification and testing, finite element analysis as well as finite element...
Decision makers are required to make critical decisions throughout all stages of a life-cycle in large-scale projects. These decisions are important as they impact upon the outcome and the success of projects. In this paper we present an evidential reasoning framework to aid decision-makers in the decision making process. This approach utilizes the Dezert-Smarandache Theory (DSm) to fuse heterogeneous...
Hydrostatic stress of Cu damascene interconnects was calculated by using finite element method in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different line width in the Cu interconnects. Then a model of atomic diffusion was presented and used to calculate the size of stress-induced voiding according to result of hydrostatic...
As a result of ICT development and the increasingly growing use of the Internet in particular, practices of language teaching and learning are about to evolve significantly. Our study focuses on the Arabic language, and aims to explore and evaluate Arabic language learning websites. To reach these goals, we propose in a first step, to define an evaluation model, based on a set of criteria for assessing...
The concept that Mission Based Maintenance Decision-making for Materiel is put forward in this paper. Keeping dependability and operational readiness after mission of material is set as goal, which includes dependability centred maintenance decision-making and operational readiness after mission centred maintenance decision-making for material. The process of mission based maintenance decision-making...
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