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An incrementally coupled mechanical-ultrasonic finite element model is developed to model the thermosonic Cu wire bonding process on Cu/low-k chips, in order to study the influences of key process and design parameters on the stress conditions in the chips. The model takes into account of both mechanical oscillation effects and the softening effects of ultrasounds, and stresses developments during...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an hazardous influence in the testing process. As well as that, the thermal resistance...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
The engine box and the bearing cover have high concentricity requirements. In response to this, cutting parameter optimization of the main bearing bore boring process is presented. Combined with the processing requirements and processing characteristics of the main bearing bore boring process, the three-dimensional finite element model was established based on the Deform-3D. The variation of cutting...
In this paper, the XYZ translational parallel micromanipulator with three-dimension is proposed. The whole mechanism is fully symmetric about x and y axes. The end-effector with the centre of the plane may acquire the ideal effect according to using the different number of S-hinges (spherical hinge with three degrees of freedom). Therefore, the four types of mechanisms with different numbers of S-hinges...
In this paper, a cavity backed spiral antenna is introduced. The antenna is a four-arm Archimedean spiral antenna. To effectively direct the radiation in the upper half space region, the spiral antenna is backed by a conducting cavity, which is peripherally filled by an absorber ring. Antenna radiates circularly polarized waves. The height of the surrounding cavity is only 7mm, which leads to an extremely...
Paraboloid of revolution shaped resonator(abbreviated as PRSR) as a new solid-state wave gyroscope resonator, is the core component of Bell-shaped vibratory angular rate gyro(abbreviated as BVG) which sensitizes angular movement through the Coriolis effect of standing wave in resonance state of axisymmetric shell. Structural characteristics of the resonator make itself have the feature of withstand...
A bearing is a machine element used to constrain relative motion and reduces friction between moving parts with necessary lubrication provided. Bi-metal aluminium bearing manufacturers say their products offer long-term durability, dry-start protection, resistance to debris, corrosion resistance and dimensional accuracy for stock and light duty, as well as performance and racing, applications. The...
The first step in FEM-based deformation is voxelization, which means objects showed in original mesh will be desecrated into mass of small units (voxels), and then the characteristic matrix can be fetched with the coordinate, shape, and attributes of voxels. This paper focuses on the reciprocity between specifying voxel physical parameter and simulating the deformation. A table list out provides physical...
This paper reviews different methods of thermal analysis, highlighting advantages, drawbacks, and limits. It represents the basics for both analytical methods and numerical ones; which the analytical method is discussed more in detail, including thermal coefficients relevant issues. Also, different applications are investigated, and related analytical and numerical techniques are represented. The...
This paper presents the finite element modelling of a three-phase synchronous machine (3 kW-1500 rpm). In addition to analyzing the electromagnetic behaviour of the machine, various tests (no-load, short-circuit and load tests) was performed virtually using Maxwell software and validated experimentally. This work aims to parametric identification of machines and creation of a virtual laboratory of...
This paper, is concerned with the determination of the eddy current losses in each part inside the rotor of the High-Speed Axial Flux Permanent Magnet (AFPM) Machine (starter / generator) that delivers a power of 18 kVA. The research is based on modeling and Finite Element (FE) simulation techniques using ANSYS where a quarter of the machine is modeled with the appropriate boundary conditions in order...
In the paper, it takes the Finite Element Method (FEM) to analyze the capacity of the combined connection with bolts and welds. The rationality of the simulation directly affects the correctness of theoretical analysis. So, it needs comprehensive consideration about the reasonable choice of elements, attribute setup, reasonable division of the grid, boundary conditions and machining sequence, etc.
Seismic action is the main external factor of affecting the long-term safe operation of the large-scale underground caverns. Strengthening characteristics of materials under high strain rate and damage of surrounding rock under circulating load features are considered. Dynamic constitutive model of rock mass is put forward to analyze seismic on the underground caverns. Explicit central difference...
The influence of viscoelastic behavior of polybutylene terephthalate (PBT) on reliability of the thermal contact of a spotlight module is evaluated. The contact between a module and the heat sink is evaluated using non-linear finite element model. The viscoelastic behavior of PBT was obtained under multiple frequencies from single cantilever DMA experiments. The relevant viscoelastic parameters (i...
In 3D through-silicon-via (TSV) interposer package, there are large numbers of micro bumps and micro solder balls, the sizes of the entities in the package having a difference of 3 orders of magnitude. This multi-scale structure brings difficulties to establish the finite element model for analyzing the thermal fatigue life of board-level solder joint. Homogenization method is adopted to avoid these...
Thermal interface materials (TIMs) which consist of metal foil and soft cushion are used in the process of chip processor platform validation (PPV) process, and some defects, such as the stains caused by debris peeled off from TIMs due to stress concentration, were found on the surface of the chips and they had an hazardous influence in the testing process. As well as that, the thermal resistance...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
An incrementally coupled mechanical-ultrasonic finite element model is developed to model the thermosonic Cu wire bonding process on Cu/low-k chips, in order to study the influences of key process and design parameters on the stress conditions in the chips. The model takes into account of both mechanical oscillation effects and the softening effects of ultrasounds, and stresses developments during...
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