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This study presents an optimal method to select the material and dimension parameters for designing microelectronics packaging devices loading hygro-thermal and vapor pressure. The failure mechanism for delamination of actual packaging devices is often a complex nonlinear function, which is a shortcoming of traditional methods. The proposed approach is a combination of Error back-propagation neural...
A novel wafer level package strategy for RF MEMS is presented in this paper, considering the important issues such as the seal material, RF feedthrough and interconnects method. BCB is chosen for the seal material due to its excellent RF performance. Analytical solutions are presented and applied for RF feedthrough design and optimization. Side-wall CPW interconnect technology, which is a novel interconnect...
In this paper, finite element method (FEM) numerical thermal simulation is performed on the given packaging configuration, and temperature as well as heat flux distribution are obtained. An optimal packaging configuration is obtained by simulating different materials and structures of the heat sink, submount, die attach, different die arrangement styles and die spacing parameters. A reasonable simplification...
With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in...
Thermosetting polymers are widely used in electronic packaging. For instance, epoxy molding compound is extensively used as an encapsulant for electronic packages to protect the IC chips from mechanical and chemical hazards. It is well known that molding compounds show not only strong temperature dependent but also time dependent behavior. The thermo-mechanical behavior of these polymer constituents...
BGAs packaging offer high pin counts and lower interconnecting space, and are suitable for high density packaging. However, it is difficult to inspect individual solder joints on BGA assembly by conventional visual methods and need a complicated practice on rework. Ball impact test is a useful method to estimate the reliability of BGA solder joint. In this study, the three-dimensional explicit finite...
Since its introduction in the early 1990s, plastic ball grid array (PBGA) package had become the ldquopackage of choicerdquo due to its good electrical performance, lower cost, high assembly yield and self-alignment during board assembly process. Thermo-mechanical behavior of PBGA is highly dependent on the properties of the constituent components. The relative mechanical compliances and thermal expansion...
Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and...
Reusability, sharability, and interoperability are the main research subjects of modern learning systems. A lot of e-learning standards, such as LOM, IMS, SCORM, AICC etc., have provided us many flexible reference solutions for achieving these goals. In order to construct a more flexible framework to share and reuse Web learning materials between CBT vendors, LMSs, and learners, this paper defined...
Microelectromechanical systems (MEMS) remain one of the fastest growing markets in the semiconductor technology industry. This growth is largely due to the increasing possibility of integration into various applications. These include the automotive industry, process control and automation, scientific and medical instrumentation, telecommunication, commodity products and environmental monitoring....
For the purpose of electronic packaging, homogeneous and void free SiCp/Al composites with high volume fraction of reinforcement (up to 73%) are fabricated by pressure infiltration technology. The CTEs of composites can be tailored in the range of 7.3-9.7~10-6/degC to match the CTEs of ceramic substrates or semiconductors. And their thermal conductivities are higher than 120 W/(mdegE). Because of...
Chip-Package interaction (CPI) has drawn much attention for very low-k (VLK) packaging technology development, especially as the electronic industry is moving from SnPb solder to lead-free solder. In this study, a multi-level finite element model is used to optimize the interconnect scheme from a packaging reliability point of view. Factors including top metal (or SiO2) thickness, passivation dielectric...
Since their inception over 30 years ago, underfills have enabled numerous new packages and have provided the required support and reliability needed for highly miniaturized and lead-free devices. It is safe to say that without these essential materials, many of today's advances would not be possible. Continued developments in underfill technology such as enhancements in filler technology, better control...
A dasiagreen scorecardpsila to identify research projects in the digital printing industry is described. The scorecard is intended to be cognizant of life cycle issues without being onerous to use, allows comparison of green dasiagoodnesspsila among scenarios, provides guidelines for use, and reduces subjectivity by requiring quantified input data. The green scorecard is neither a design tool, nor...
Market demand is increasing for even higher packaging densities, smaller size, lower cost, and more heterogeneous functionality. As a result, three dimensional (3D) packaging has emerged as a leading packaging solution. This paper introduces a 3D Wafer Level CSP packaging architecture that provides a cost effective, rapid time to market alternative to emerging 3D die to wafer integration technologies...
According to the principle of Just-in-time (JIT), an optimized design of job processing flow of storage, distribution and package etc. for vegetable distribution center has been presented by applying technology of RFID and barcode to obtain tracing information of material flow and to control the processing flow in this paper. In accordance with the physical and biological characteristics of fresh...
High power diode lasers have found increased applications in pumping of solid state or fiber laser systems for industrial, military and medical applications as well as direct material processing applications. The non-linearity of the near-field of emitters (or the so called ldquosmilerdquo effect) in a laser diode array poses significant challenges in optical coupling and beam shaping and has become...
Amkor's FCMBGA, flip chip package based on transfer molding for high performance device was developed and introduced to industry in 2008[1,2]. During the molding process, bump deformation was not significant, and voids were not observed under flip chip die. Coplanarity with a low coefficient of thermal expansion, CCTETE, substrate construction was similar to a single piece lidded package construction...
This paper introduced the structures of the common forms of packaging products, and introduced briefly the idea of finite element analysis and ANSYS. They are the key to solve the problem of this paper. This paper is based on this, and used the finite element analysis software ANSYS to static compression simulation analysis to the commonly used structure of paper-pulp model. Through the structural...
When a rotor comes a part, it results in flying fragments. The fragments are impacted and penetrated in electric machine casing. Containing failed parts in high speed electric machines can be a real safety concern. This paper presents an advanced method for dynamic analysis of high speed failed part penetration in machine housing, based on plastic deformation theory with dynamic corrections. A comprehensive...
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