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Robust climbing in unstructured environments is a long-standing challenge in robotics research. Recently there has been an increasing interest in using adhesive materials for that purpose. For example, a climbing robot using hot melt adhesives (HMAs) has demonstrated advantages in high attachment strength, reasonable operation costs, and applicability to different surfaces. Despite the advantages,...
Thermal characterization of high power microwave devices is important for determining their reliability. Exceeding the optimal temperature will have a detrimental effect on the performance and reliability of these devices. However, temperature characterization of submicron features is often challenging and numerical simulations are often used. In this paper, a detailed finite element thermal model...
LED is the revolution in the illumination industry due to its great performance of solid state lighting, environment friendly working, power saving and long lasting life. But dissipation of heat generated and subsequently the thermal management in the LED package is a challenge. A steady state thermal analysis of a typical high power LED model with power dissipation values ranging from 1– 3W, consisting...
The superior thermal transport in graphene has been a topic of great interest to the scientific community, for graphene is envisioned to be important in numerous applications such as thermal management of electronics. While single layer graphene exhibits high thermal conductivity, molecular and lattice dynamics simulations reveal that even in the presence of one or few additional layers, thermal conductivity...
In SLM, a high energy density is applied by a laser to locally melt layers of metallic powder particles in order to create functional parts. This high energy intensity and additive process character create a specific/unique microstructure. The solidified melt pools in HSS M2 SLM parts are observed to consist of two distinct zones next to the heat affected zone. The first zone, at the bottom of the...
The peridynamics is an emerging nonlocal continuum theory which allows governing field equations to be applicable at discontinuities. This applicability at discontinuities is achieved by replacing the spatial derivatives, which lose meaning at discontinuities, with integrals that are valid regardless of the existence of a discontinuity. This study presents a fully coupled peridynamic thermomechanical...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured...
In this paper, a fast electrical-thermal co-simulation method based on multigrid approach is proposed for simulating 3D systems. Using the proposed approach, accurate voltage/current distribution with temperature effect as well as temperature distribution with Joule heating effect can be obtained efficiently. By ensuring smoothly stretched gridding between die region and package region, fast convergence...
Numerical modeling of high temperature pressure pipes including delaminations were constructed using ANSYS, then heat flux and convection are loaded on the outside surface. The influence of pulse excitation parameters, depth of defects, thickness of defects, length of defects on maximum thermal contrast and time for maximum thermal contrast are analysised. Length of defects are measured by using the...
Thermal management in 3D packaging plays an important role in the device performance and reliability. The development of thermally conductive underfills is highly crucial, but still challenging. In this work, single/few-layer boron nitride (BN) was exfoliated from bulk h-BN flakes and was incorporated into epoxy resin via a solvent transfer method.[1] The structure of exfoliated BN was characterized...
Thermal spreading or constriction resistances exist whenever heat flows from one region to another in different cross sectional areas. In this study, the ideas of Isotropic half-space and Heat flux tube are numerically modeled in order to estimate the thermal spreading/constriction resistance. Furthermore, the thermal spreading resistances of the Silicon in arbitrary temperature and heat flux ranges...
A novel, reservoir-type hollow cathode has been designed, constructed and tested. It provides improved control of the barium dispensation rate to the electron-emitting surface and superior structural integrity relative to previous art. The cathode offers the possibility of much longer life than currently used impregnated dispenser cathodes. This is due to its larger barium supply capacity and lack...
The research objective was to investigate reducing the rhenium concentration in Mo-Re alloys which would allow Semicon Associates to decrease the raw material costs while enhancing the electrical properties of a dispenser cathode.
The contribution presents a flexible simulation model of thermoelectric devices, suitable for the design and control verification of related energy systems, e.g. waste heat recovery by a Thermoelectric Generator. The models are built according to the object-oriented scheme of the Modelica® language. Based on the essential physical effects of thermoelectric materials, the model components are applicable...
The optimum operating temperature of a Polymer Electrolyte Membrane (PEM) fuel cell is approximately 80°C. The electrochemical reaction inside a PEM fuel cell stack produces approximately 50% of electrical and 50% of heat energy. The power output of the fuel cell stack is significantly influenced by the humidity and temperature inside the power stack. Therefore, an effective cooling system is necessary...
This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C...
Super-lattice thin-film thermoelectric coolers (TEC) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). The thermal compact models of the chip and package with integrated TECs are developed and used for steady-state and...
The conjugate heat transfer within a bottom-heated non-conventional cylindrical enclosure is important with respect to the processes in chemical and nuclear industries. In this research work numerical analysis of the enclosure with respect to the centrifuge machines used in the process industry is presented. Various CFD simulations of the experimental work of [1] are performed to study the effects...
Scattering near-field microscopy with heated tips is used to spectroscopically characterize the spatially and spectrally distinct infrared thermal near-field demonstrating for the first time the resonant enhancement of the underlying electromagnetic local density of states.
Three dimensional integration technology has the potential to provide enhanced performance and device density gains beyond that available from technology scaling alone. However, it provides plethora of design choices for system designers. The full exploitation of the benefits of 3D integration requires a system-level exploration flow which can facilitate in finding an optimal 3D design by comparing...
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