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Thermal interface materials (TIM) used to improve the conductivity between mating components in an electronic assembly are discussed. A variety of materials including adhesives, gels, greases, fluids were used in this study. Both greases and pastes are considered, to improve the contact resistance of stress decoupling and stress coupling interfaces, respectively. Nanoparticles, micro particles, low...
Thermal Interface Materials (TIMs) are particulate composite materials widely used in the microelectronics industry to reduce the thermal resistance between the device and the heat sink. Predictive modeling using fundamental physical principles is critical to developing new TIMs, since it can be used to quantify the effect of polydisersivity, volume fraction and arrangements on the effective thermal...
Compliant Thermal Interface Materials (TIMs) or Gap pads are an important material set in many applications including automotive electronics. Commercially available Compliant TIMs exhibit significant time-dependent deformation under compression limiting their utility. While these materials are expected to enhance thermal transport by filling gaps, their (often viscoelastic) mechanical behavior is...
Thermal spreading or constriction resistances exist whenever heat flows from one region to another in different cross sectional areas. In this study, the ideas of Isotropic half-space and Heat flux tube are numerically modeled in order to estimate the thermal spreading/constriction resistance. Furthermore, the thermal spreading resistances of the Silicon in arbitrary temperature and heat flux ranges...
Several refractory metals and alloys, usually selected as traveling wave tube (TWT) helix materials, were briefly described in this paper, and then an analysis was presented in terms of thermal, electric and mechanical properties of these materials. It was pointed out that tungsten–rhenium alloys might be the most promising candidates for helix materials due to their combinative properties for high...
The VORPAL finite-difference time-domain particle-in-cell simulation tool now has thermal solver capability, which we are using to model transmission lines and accelerating cavities of cryogenic SRF accelerators. This same capability can be brought to bear on room temperature problems EM and Thermal physics. Our thermal solver treats the non-linear evolution of the material properties, such as electrical...
This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C...
The conjugate heat transfer within a bottom-heated non-conventional cylindrical enclosure is important with respect to the processes in chemical and nuclear industries. In this research work numerical analysis of the enclosure with respect to the centrifuge machines used in the process industry is presented. Various CFD simulations of the experimental work of [1] are performed to study the effects...
A simple, room temperature process was reported to fluidic assemble dense, vertically aligned SWNTs between two chips and connect them together. This technology has the potential capability to attach a die to its heat sink in packaging replacing the common available die adhesives by virtue of better mechanical and thermal properties. Two chips with trench about 2 μm deep on the pre-treated surface...
Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void...
Researching for the multi-ribbed compound wall. Testing the thermal conductivity of materials. For thisMulti-Ribbed Wall, giving the Computational Method of the heat transfer coefficient. And getting the insulation thicknes which meet the requirements of the housing in cold rural areas.
Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through interface. In this study, Al203 with different thickness was coated on a copper substrate. The overall thermal conductivity...
Thermal interface resistance of solids is an important factor for heat conduction from one solid to another. Interface resistance disrupts heat flow in systems like CPUs and various solid state devices like LEDs. Interface materials play an important role in heat transport through an interface. In this study, TiN/Ti with different Ti thickness and Ti/TiN was coated on a copper substrate. In general...
The n-type nonstoichiometric Pb0.55Te0.45 materials were prepared by melting and quenching combined with a subsequent high pressure high temperature (HPHT) treatment. After adequately annealed at 623 K in the argon atmosphere, the thermoelectric transport properties of the prepared samples have been systematically investigated. The results show that the pressure effectively adjusts the carrier concentration...
With the rapid increase of heat generation, thermal interface material (TIM) is becoming one of the most important materials of micro-electronic. In-based solder TIM has high thermal conductivity, but its high cost and low mechanical properties become the obstacles of its application in industry. In order to improve the shear strength of In-based solder-TIM, we add Al particle into melting InSn to...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface...
Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNT) exhibit high electrical and thermal conductivity. Moreover CNT improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesive...
Thermal management in electronic circuits is becoming an important integral part of design considerations. Increasing power densities and speed of advanced computer chips motivate the search for more efficient thermal interface materials. Here we report preliminary results of experimental and theoretical investigations of the epoxy composites, which use the liquid-phase exfoliated graphene and few-layer...
The effect of heat treatment on thermal conductivity of 6063 aluminum alloy was studied, and the mechanism of heat treatment(homogenizing, solution, aging treatment) of the alloy was discussed. The results indicate that homogenizing treatment is conducive to microscopic structure of the alloy, the microstructure is fine and the heat conductivity is high after homogenizing treatment technology at 560...
The thermal performance of building envelope is a major requirement for generating a comfortable and hygienic interior environment. A roof is a main part of building envelope and provides protection from thermal damage caused by the excessive hot sunshine. In order to improve this thermal roof performance, the use of the air gap in the roof can be considered. This study presents a new type of open-web...
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