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In this study, the vibration reliability at elevated temperature was evaluated on Pb-free solders (Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb). Daisy-chained BGA chips with ENIG finish was assembled on FR-4 PCB with OSP finish. After fabrication of test modules, vibration test was performed under resonant frequency with acceleration of 3G-level at 150°C. To understand the difference of reliability among three...
With the increasing speed of information and communication equipment in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there...
Reliability of palladium coated copper wire is believed to have enhancement over bare copper wire. With current understanding, the main failure mode in copper wire bonding is galvanic corrosion of the less stable Cu9Al4 intermetallic compound (IMC) phase in the highly accelerated stress test (HAST). In gold wire bonding, palladium (Pd) is known to retard formation of the corrosive prone Au4Al phase,...
Copper (Cu) wire development started in the early 1980's as the cost for semiconductor manufacturing has become competitive and challenging with the increase of gold price. The lessons learned along the research and studies carried out, helped the industry to understand the subtleties and facts about Cu wire bonding process. The most common and important facts about Cu wire bonding is its sensitivity...
The industry has traditionally maintained an average 15% cost down per year per function over the range of products it offers. Part of this reduction comes from packaging where manufacturing efficiencies such as cycle time reduction. supply chain management, and yield improvement allow for continued reductions in the cost per I/O. As the leaded package families are expected to increase in volume,...
We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed...
Conductive adhesives provide advantageous properties for many electronics assembly applications (low processing temperatures, high flexibility) and they are green materials. However, the limited electrical and thermal conductivity of conventional conductive adhesives restrict their usage in most cases to low to medium power density packages. The novel mAgic silver sinter adhesives feature the conventional...
This paper is part of a larger project which aims to investigate the fabricational and electromagnetic advantages of creating integrated antenna systems using emerging nano-manufacturing technology. It has been known for several decades that the effective permittivity of a mixture consisting of dielectric inclusions in a host dielectric can be controlled by varying the permittivity, size and spacing...
The most commonly used grounding materials in China are galvanized steel, copper and copper clad steel. The effect of grounding material corrosion on the reliability of electronic equipment is of growing importance as the growing of power capacity. For better understanding the factors influencing the protective effects against corrosion by zinc and copper coatings, two experiments have been performed...
The performance of Double Sided silicon Strip Detectors (DSSDs) and Kapton cables for the Silicon Tracking System (STS) of the upcoming Compressed Baryonic Matter (CBM) experiment at FAIR is being reported. The CBM STS will consist of 8 stations of DSSDs at a distance between 25–100 cm downstream of the target. These DSSDs have a pitch of around 58 µm, stereo angle of ± 7.50 with double metallization...
Transformer is one of the costliest apparatus in an electrical power supply network which play vital role in an electrical power system. It is expected that all transformers installed in a substation must function optimally under normal as well transient conditions. Their satisfactory performance of transformers can be ensured by making use of latest trends in condition based monitoring. This helps...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of...
The effects of Ni element on the morphology of intermetallic compounds and some mechanical properties of SAC-Bi-XNi/Cu lead-free solder joints have been investigated. The corresponding mechanical and reliability behaviors were evaluated by performing shear test, fracture mode analysis, nanoindentation experiments and measurement of IMC before and after isothermal aging 200h and 400h at 160°C. The...
The project VISA (German abbreviation of “fully integrated power electronic systems for automotive electronics”) gives an answer to future challenges to electronic printed circuit boards in automotive applications. VISA was a three year funded project by the Federal Ministry for Education and Research. The i² Board concept, developed by Schweizer Electronic was investigated for automotive application...
Recently, the development of low-Ag Sn-Ag-Cu (SAC) solders has become a new research field in electronic packaging industry because of the braze reliability and cost concerns. In this study, the shear strength and interfacial microstructures of two kinds of low-Ag solder joints, SAC/Cu and SAC-Bi-Ni/Cu, were investigated. The results obtained affirmed that the addition of Ni and Bi in low-Ag SAC0705...
This study was concerned on the growth behavior and the size characteristics of the interfacial intermetallic compounds (IMCs) between solder and Cu substrates during isothermal aging. Through the analysis of the 3D volume, 2D area, and the thickness of the IMC, a scientific method of characterization of the IMC's thickness size was found. That is using the image analysis software to calculate areas(S)...
This paper present the transformer design optimization problem. The objective of transformer design optimization problem requires to minimizing the total mass (or cost) of the core and wire material by satisfying constraints imposed by international standards and transformer user specification. The constraints include appropriate limits on efficiency, voltage regulation, temperature rise, no-load...
Cu wire is the alternative material to the Au wire in many aspects, such as better electrical and thermal conductivity, higher mechanical strength and its lower cost for the high volume manufacture. Due to the surface oxidation of the Cu wire, the Pd-plated Cu wire (Pd-Cu wire) has been adopted quickly in many fine pitch and high density package devices. Cu wire bonding has been well understood in...
SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead...
The different effects of OSP and ENEPIG surface finishes on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu flip chip solder joint were investigated at 150°C under a current density of 1×104 A/cm2. In as-soldered state, the interfacial (Cu0.55Ni0.45)6Sn5 IMC formed on Ni UBM at the chip side in both OSP and ENEPIG joints. However, the EM resistance of the two joints was greatly different...
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