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As the miniaturization of the devices is progressing the chips have to have more functions and cover less space. One of the methods to achieve this goal is usage of Package-on-Package (PoP) technique. In this paper the influence of used soldering profiles on joints reliability will be presented. The boards had ENIG as final coating. The reliability was checked by the monitoring of resistance as the...
A nanocopper-based interconnect material was developed as a robust, high-performance alternative to solder. This new solder-free nanocopper material overcomes an inherent limitation of traditional solders wherein the operating temperature is limited by the processing temperature. For the first time, an interconnect material is capable of operating at temperatures not only equal to but even far above...
In this study, Sn/Cu soldering interface and the growth characteristics of IMC grains were in-situ investigated. High-pressure air (0.8MPa) was used to blow away the residual liquid solder on the Cu substrate at different soldering temperatures (250 ° C, 275 ° C, 300 ° C) and different soldering time (10s,30s,60s,120s), thereby obtaining the unobstructed view for growth morphology of IMC in the heating...
Since the initial design layout of hybrid integrated DC/DC (direct current) power converter modules on the printed circuit board exists some disadvantages, the vibration reliability problems of DC/DC modules assembly, such as casing wear, glass insulator, are arisen during the service condition. For in-depth study of the above circumstances, this research conducted random vibration numerical simulations...
The effect of Pb content on fatigue life of mixed SnAgCu-SnPb solder joints was investigated by thermal cycling with temperature ranging from −55°C to 125°C (with 10 min dwell times and 10°C/min ramp rate). The cross-sections of mixed solder joints were characterized by scanning electron microscopy equipped with energy dispersive spectrometry. The results showed that the thermal fatigue life of Sn3...
Electronic devices and solder joints inside the devices are always exposed to thermal loads, which would change the microstructure of solder joints. It is well known that the growth of the intermetallic compound between bulk solder and substrate and the change of the structure in bulk solder itself might lead to fatigue crack of solder joints. The objective of this study is to demonstrate the change...
With the decrease of the size of lead-free solder joints, the reliability of solder joints is particularly prominent, which is critical to the mechanical behavior of solder joints. While in the actual production process, the stresses for solder joints are often complex. In this paper, the nano-indentation is used to obtain the mechanical behaviors and the step behaviors of Sn3.0Ag0.5Cu and Sn0.3Ag0...
Preparation of BGA micro-joint with single-double substrates used by SAC305 lead-free solder is fabricated by reflowing process based on substrate FR-4. The microstructure change and evolution law of the solder joints are studied through the method of rapid thermal fatigue. The single-base plate SAC305/Cu solder joint was tested at extreme temperature 60–200°C by rapid thermal cycle 24 hours and 36...
This paper investigates the reliability of the Package-on-Package (PoP) under random vibration loading by experimental tests and FEM simulations. An event detector was used to monitor the PoP failure times under random vibration. A finite element model of the PoP assembly model was built in ANSYS, and the natural frequencies and modes were calculated and verified by experimental model test. The results...
Electronic systems are exposed to stress conditions during their life cycle. Chemical substances such as moisture and acid are the major source of stresses. The chemical stress condition can induce chemical degradation of electronic components and interconnects including solder joints. Chemical degradation often leads to malfunctions of electronic systems, ultimately resulting in system failure. To...
This paper reports on the development of packaging technology for the assembly of 30µm pitch micro Cu pillar bump (15µm diameter) on organic FCCSP substrate having bare Cu bondpad without NiAu or OSP surface protection. The assembly was performed by thermal compression bonding (TCB) with non-conductive paste (NCP). Finite element modeling and simulation were carried out to understand the Cu pillar...
Gallium liquid metal joints are described as an alternative to higher melting point tin-or lead-based solder joints in flip chip packages. A complete assembly process is described, including the bumping process with the electrodeposition of gallium on corrosion resistant bonding pad, a low-temperature and low bonding force chip joining process with a HCl flux, and an underfill process with a low stiffness...
Microbumps are widely used to interconnect stacked chips with through-Si-vias (TSVs) in vertical direction to enable 3D IC integration. Several recent studies reported [1, 2] that a unique porous void formation was found in Cu-Sn microbump particularly in Cu3Sn layer. This porous Cu3Sn formation was only reported in microbump which has constrained joint thickness (
Joint properties of a La2O3-nanoparticle-added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder were investigated in this study. Nano-composite solders which contain second-phase nanoparticles in the solder matrix are known to possess high mechanical strength and creep resistance. In this study, La2O3 nanoparticles were mixed with a Sn-Ag-Cu solder paste and the solder joint properties as well as the process...
The use of sensors has significantly increased in both domestic and industrial applications. In some applications, the sensor component is used along with a heat-sensitive component, therefore, the attachment process using common lead-free solders that have high melting temperature (e.g., Sn-Ag-Cu, Tm = 217 °C) may be challenging. Among lead-free solders with low melting temperature, Sn-8%Zn-3%Bi...
As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described...
In the electronic industry the portable devices are becoming the prime factors to dominate the market share. And with the blessing of miniaturization, these devices are also becoming smaller and smaller day by day. On the other hand, with this miniaturization process these devices are becoming more susceptible to drop impact loading. To ensure product quality and to integrate more complicated functionality...
In this paper, solder joint reliability of a Chip Scale Package (CSP) with polymer core solder balls (PCSB) was evaluated. Temperature cycling data was obtained from both conventional and polymer core balls tested on chip scale package with pitch 0.5mm mounted on an 8 layers HDI board. FEM simulation was also performed to compare the polymer core balls with a conventional solder ball. This study has...
This paper presents a comprehensive study on the reliability of QFN components for aerospace applications, particularly the impact of conformal coatings on the reliability of such QFN assemblies was investigated. Both experimental and computational modeling techniques are discussed. In the experiments, several types of plastic and ceramic QFNs assemblies were subjected to accelerated thermal cycling...
Multi-terminal passive components like interdigitated capacitors (IDCs) are a key enabler for power supply decoupling and controlling transient chip responses at high frequency for improved performance and functionality. To ensure higher performance is achieved, the integrity of the solder joint connecting the passive component to the organic build-up substrate in a flip chip ball grid array (FCBGA)...
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