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This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
Power electronic modules (PEMs) are widely used in aerospace and automotive applications where high reliability is essential. Solder joint fatigue is one of the major failure mechanisms in PEMs, a reliability assessment method for this failure mechanism is presented in this paper. Differing from the traditional reliability prediction methods, this approach allows the reliability performance of PEMs...
This study aimed to evaluate the drop reliability using Ag content and metal additives in a Sn-Ag-Cu system composition. In this study, the main compositions of the solder ball were Sn1.0Ag0.5Cu and Sn0.5Ag0.5Cu, respectively, and Ni and Co elements were additions a additive element. The PCB plating was used Cu-OSP, immersion Sn, electroplated Ni/Au, and ENEPIG (electroless Ni electroless Pd immersion...
Over the past few years, the Sn-3.0(wt.%)Ag-0.5Cu alloy has become a representative Pb-free solder material in the microelectronic packaging industry. However, Sn-3.0Ag-0.5Cu exhibits significantly poorer performance than eutectic Sn-Pb under high strain rate conditions, such as drop testing. It was previously suggested that a quaternary alloy with the composition, Sn-1.2Ag-0.7Cu-0.4In, is a promising...
The increasing demand for portable electronics has led to the shrinking in size of electronic components and solder joint dimensions. The industry also made a transition towards the adoption of lead-free solder alloys, commonly based around the Sn-Ag-Cu alloys. As knowledge of the processes and operational reliability of these lead-free solder joints (used especially in advanced packages) is limited,...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
Drop performance for fine-pitch ball grid array (FBGA) assembly is one important issue because FBGA is widely used in handheld electronic products in which the solder joints are prone to failure when subjected to drop impact load during application. It is necessary to assess and improve the FBGA solder joint drop performance during design and engineering stage. The drop impact life model is needed...
To satisfy the requirements of the newest mobile product, smaller solder ball is needed for electronic packages such as chip scale package (CSP). The purpose of this study was to investigate the effect of solder ball size on the interfacial reaction. In this study, 400, 300, and, 200 ??m diameter solder balls of 98.5 wt.% Sn, 1 wt.% Ag, and 0.5 wt.% Cu(SAC105) were formed on the Cu/OSP and electroplated...
Intermetallic compounds (IMCs) properties play a significant role in determining the reliability of solder joints in service. IMCs and their evolution become more important for devices with micro- or nano-scale joints used in cryogenic applications. In this study, the interfacial reactions of In/Cu and In/Ni/Cu due to low-temperature cycling are investigated. The results illustrate that the character...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for some test...
Electromigration of flip-chip solder joints has been studied extensively in recent years. It was investigated in plenty of studies that the current crowding effect takes place at the corner near the traces due to huge differences of dimensions between traces and solder joint. The local high current density, which has been known as a serious reliability issue, causes the failure such as void formation...
The formation and growth of intermetallic compound layer thickness is one of the important issues in search for reliable electronic and electrical connections. Intermetallic compounds (IMCs) are an essential part of solder joints. At low levels, they have a strengthening effect on the joint; but at higher levels, they tend to make solder joints more brittle. If the solder joint is subjected to long-standing...
Board level solder joint reliability was evaluated using a 4-point monotonic bending test on different BGA package assemblies, including a 51 ?? 51 mm 2400 CBGA and a 40 ?? 40 mm 1517 PBGA. The edgebond epoxy was applied between the package samples and solder-attached printed wiring boards (PWBs). During the bending test, the PWB strain, bending force and daisy-chain resistance were monitored in real...
To eliminate the process of stacked with wire bonding interconnection technology, a through via silicon interposer which is used in stacked dies flip chip are assembled in this study currently. In this study, stack assembly process sequence and the sequence effect on solder joints formation 2nd level joints (between interposer chip and substrate) will be presented. 2nd level joints will be compared...
In this paper, we discuss a unique combination of experimental analyses employed to monitor, understand, and ultimately eliminate micro voids formation in the epoxy matrix of flip chip underfill during curing. Present day flip chip packages require the use of underfill epoxies to achieve reliable C4 bumps solder joints on the board level. Many different types of underfill epoxy chemistry have been...
The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications. Reliability issues associated with the operation of HTE devices have been shown to account for some of the recent aircraft crashes as well as failures of the electronic control Unit in modern vehicles. The reliability...
Information processing has been thought of as a key to ubiquitous systems. Operating systems composing ubiquitous systems are also important since ubiquitous systems do not provide desired performance when the operating systems fail. Bluetooth module becomes a critical item for these operating systems. Thus, accurate reliability estimation of the module under various environmental conditions is required...
The system-in-package (SiP) is among the popular package structures which meet the trend of integrated circuit (IC) product development. The SiP structure investigated in this study includes seven sub-chips attached to the chip carrier, with polymer applied around the chips. The polymer is used as an exceptional stress buffer layer and it can reduce the stress/strain in the solder joints. However,...
In this work, the SAC solder joints with minor Mn or RE (rare earth) additions were bonded on the substrate of OSP Cu surface finishes for evaluating the influence of minor alloying on BIT (ball impact test) behavior. The Mn-doped samples had a better resistance to the degradation in BIT performance suffering long time aging at 150??C. The greater impact force and toughness compared to the other samples...
The Package on Package (PoP) component is getting attentions in mobile communication electronics industry to meet the miniaturization requirements. The 3D IC packaging technology is employed to achieve higher integrations for multiple functions. This also concurrently reduces the size of PCB during second level of interconnection. Currently, there are two major approaches for system manufactures....
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