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In recent years, the 2.5D IC (Integrated Circuit) package with TSV (Through Silicon Vias) has become important for high-bandwidth and high-performance applications. It is well known that 2.5D technology requires significant innovation in the areas of process technology, packaging, design, thermals, and test solutions leading to several hundred new technologies in a single product. With these complex...
This paper compares the attributes of the embedded wafer level BGA (eWLB) and a flip chip package structure, called Fan-Out Chip Last Package (FOCLP). The comparison involves a study in finite element modeling, advanced warpage metrology, reliability testing and physical structure comparisons. The purpose of this study is to understand the similarities and differences between these two package structures...
With the constant innovation and development of the advanced materials and technologies in the field of optoelectronics, a variety of applications adopting the benefits of optoelectronics is increasingly penetrating into our daily routines. The way of packaging has a huge impact on the performance of optoelectronics in mechanical, electrical as well as optical properties. Particularly, flexible packaging...
As more exotic materials are being used in Electronics devices, there are often tradeoffs to be made on the assembly process in order to utilize such components. One common constraint is the temperature sensitivity of some of these materials, such as the potential thermal degradation for certain newer exotic substrates or the inability of some biologically-active species to tolerate elevated temperatures...
Fan-out chip on substrate (FOCoS) is defined as the fan-out package flip-chip mounts on high pin counts ball grid array substrate. 12-inch advanced wafer level package (aWLP) process is implemented on FOCoS for cost saving advantage. The fan-out package constructs from multi-chips with short interconnection between die to die (D2D) by re-distribution layer (RDL) process, which has the potential for...
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application processor chip with memory package for smart mobile devices. This novel InFO technology is the first high performance Fan-Out Wafer Level Package (FO_WLP) with multi-layer high density interconnects proposed to the industry. In this paper we present the detailed comparison...
This paper demonstrates, for the first time, a high density, low cost redistribution layer (RDL) stack-up using a novel, ultra-thin dry film photosensitive dielectric material for panel scale 2.5D glass interposers and fan-out packages. The salient features of this semi-additive process based RDL demonstrator include: (1) A two metal layer RDL structure with integration of 5 µm microvias at 20 µm...
Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects at the nano-and microscale can greatly impact the performance and functionality of the entire power module. The first example correlates the microstructure...
Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
As Cu bump is widely adopted in microelectronic IC product packages for broader scope of applications throughout network communication and handheld device, it impacts on the interconnection joint integrity of package substrate to IC pad need to be well understood and managed which becomes even more critical as extreme Low-k (ELK) inter-metal dielectric material (IMD), with lower mechanical strength,...
Multi-terminal passive components like interdigitated capacitors (IDCs) are a key enabler for power supply decoupling and controlling transient chip responses at high frequency for improved performance and functionality. To ensure higher performance is achieved, the integrity of the solder joint connecting the passive component to the organic build-up substrate in a flip chip ball grid array (FCBGA)...
The decreasing size of solder joints leaves limited tolerance of allowable warpage range for successful assembly. Understanding the electronic packages' behavior during the reflow process becomes one of the most important tasks in developing assembly process and assuring reliability. Three-dimensional (3D) digital image correlation (DIC) plays an important role in quantifying warpage of BGA packages...
Increasing power densities in electronic systems and their operation in harsh environments necessitate the development of packaging materials capable of withstanding extreme thermal conditions. Transient Liquid Phase Sintering (TLPS) has been demonstrated as a packaging technology with the potential to form reliable interconnects for electronic systems for these environments. During processing, the...
The demands for the next generation organic laminate materials include high speed signal (HSS) performance enhancements as well as improvements in bond and assembly processing yields. A typical organic laminate structure consists of one or more layers of build-up and copper on each side of a copper clad core. The industry has recently incorporated coreless laminates mostly in small die packages to...
This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 µm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 µm pitch. The designed test vehicle emulates an application processor package for smart mobile applications, and enables for the first time measurements of DC signal transmission...
The production of reliable power modules capable of achieving higher power densities and higher junction temperatures is limited by the present assembly and packaging methods, mostly in the areas of the die-attach and the top level interconnections. The resultant bondline consists of intermetallic compounds with higher melting point than the used interlayer material, thus making this technique applicable...
In the present article, we report a breakthrough approach for the rapid growth of whole void-free and highly preferred orientation Cu6Sn5 IMC interconnects of 50 µm thick by the current driven bonding (CDB) interconnect method and the use of a single crystal seeding substrate. There was no grain boundaries within the Cu6Sn5 IMC interconnect and no voids at both interfaces, which is beneficial for...
Increasing needs for functionality, performance and system miniaturization in fine-pitch consumer applications have been driving a new class of ultra-thin interposers and packages with larger body sizes, aggravating warpage. These trends gave rise to serious concerns for assembly yield and reliability, especially at board level. The recent adoption of substrate technologies with silicon-matching coefficient...
The advancement of Si and flip chip package technologies are driven by high performance mobile processors with high I/O counts. In Si, the back-end-of-line (BEOL) copper interconnect with extreme low-K (ELK) dielectrics has been used to lower RC latency. While for packages, fine-pitch Cu bump is introduced to meet the high I/O density. Corresponding assembly solutions such as thermal compression bonding...
A new dry-film photosensitive dielectric material (PDM) named PDM-1 with low curing temperature (180°C) has been developed. The lithographic process evolves exposure equipment widely used in solder resist process, which make this PDM-based fine pattern fabrication technique intrinsically high production compared to the laser ablation method. The PDM-1 is able to deliver sufficient resolution for high-density...
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