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The interest in wearable electronics has been rapidly increasing due to the high demands for various wearable devices such as smart glasses and smart watches which satisfy the needs of today's customers. Future wearable devices will require fully flexible chip packaging performance and also maintain stable electrical performance under repeatedly bending environment. To meet these requirements, ultra-thin...
X-Ray Diffraction (XRD) is a very efficient experimental tool for strain/stress analysis at different scales, which makes possible to carry out some mappings in complex 3D flip chip assemblies. First, with single crystal method, both the chip and the substrate have been analyzed at the same positions, considering a 1mm2 step, in order to quantify the level of stress inside. Then Kossel microdiffraction...
As power demands for microelectronic devices continue to rise, new techniques for heat dissipation require innovative fabrication solutions such as on-chip cooling methods. The mechanical reliability of these high-powered, high-pressure systems is particularly sensitive to the interfacial strengths within the microelectronic architectures. In research at Georgia Tech, on-chip cooling methodologies...
Ultra fine-pitch interconnection technologies using non-conductive films (NCFs) have been actively developed in electronic packaging industry. However, NCFs that are based on polymer material has different material properties compared with silicon resulting in critical reliability issues. Particularly, reliability degradation from NCFs delamination and interconnection crack can take place due to coefficient...
Wafer Level Package (WLP) has become mainstream solution for handheld and mobile applications that require less Printed Circuit Board (PCB) footprint but comes with lots of functionality especially designed for high tier premium smartphones available in the market today. 28nm (RF) WLP is the bleeding edge of technology with regards to smallest transistor available in WLP packages that is in high volume...
This paper is an effort to put together all the potential applications of Wide Bandgap (WBG) devices in AC electric drives. Low inductance motors, high speed motors, and electric drives operating in a high temperature environment are the main application areas of WBG devices. Low voltage permanent magnet motors and slotless motors have a low inductance and require a stringent high-bandwidth current...
Recently linear codes with locality properties have attracted a lot of interest due to their desirable applications in distributed storage systems. An [n, k, d] linear code with (r, δ)-locality can enable the local recovery of a failed node in case of more than one node failures. In this paper, we study the theoretical bounds and constructions of linear codes with (r, δ)-locality for all code symbols...
Emerging fan-out packages require advances in mold compounds, polymer interfaces to metals and silicon, and innovative processing to reach the required high reliability. In this paper, we discuss the fracture energy for mold compound interface to copper and silicon, and use that information for studying interfacial delamination propagation of mold compound. We have examined mold compound delamination...
A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-µm and submicron RDL wafers were fabricated at a foundry and then the essential parts of the inorganic RDL were integrated with Amkor's internal organic RDL process making a hybrid structure. Also,...
Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration...
Multi-object tracking is often hindered by difficulties such as occlusion and illumination change. In this paper, we propose a novel multi-object tracking method based on main-parts model. Main-parts model is formulated by segmenting parts of object and accumulating variations of appearance from previous frames. We assume that parts with weaker appearance variations are main-parts of an object. By...
The effect of glass type used as fan-out carrier substrate on the reliability of the electrical devices were investigated. Glasses with thermal expansion coefficient of around 6~8 ppm/K with and without alkali ions involved in the glass were tested. With using non-alkali type glass as the carrier material, it was confirmed that the lifetime of the test vehicles were longer than that heated with conventional...
WLCSP has been widely adopted for package solution of the portable and wearable electronics products by its advantages of very low package cost and good electrical performance. Knowing WLCSP provide almost no protection to silicon IC chip, its quality and reliability performance becomes critical for successful product application. A 28nm TV with extreme Low-k inter-metal-dielectic material (ELK IMD)...
Fine pitch copper (Cu) pillar bump adoption has been growing in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities. Assembling such packages using...
Through Silicon Via (TSV) processing is crucial for the later performance and reliability of a device. Therefore, an accurate and efficient metrology loop to control and inspect underlying production steps is essential. Specifically, the TSV depth is of importance and must be constantly monitored to guarantee high yield of the final product. This joint work presents a fast and reliable study to control...
An innovative TSV approach that removes the historical limitations of Cu and W filled TSVs, making W TSVs once again attractive. Both films have their own advantages and disadvantages. Cu TSVs has two major advantages, one Cu electroplating has the ability to fill high aspect ratio vias enabling a wider via compared to W, and two Cu resistivity is much lower than W enabling a lower resistance via...
An overview of three-dimensional integrated circuits (3D ICs) is presented in this paper. The key potential applications of 3D ICs that have the most impact in terms of performance, power and area are highlighted, followed by a brief overview of the different technology approaches to implement 3D ICs. Further, the key challenges to 3D integration are discussed here.
In this paper, analytical and simulation based analysis to verify the inherent properties of SiGe HBT is done. The major performance parameters of SiGe HBT are cut-off freuency fT, maximum oscillation frequency fmax, base transit time τb, current gain β and electron mobility μn of SiGe base. These performance parameters are responsible for the reliability of SiGe HBT. Temperature is one of the major...
As IC technologies continue scaling down, traditional electrostatic discharge (ESD) devices can no longer meet the demands of modern protection, prompting the need for novel device structures. A novel and unique approach to ESD protection using suspended graphene ribbon devices is presented. It has been demonstrated the ribbon's electro-mechanical response to a sudden surge of charge, such as an ESD...
A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.
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