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While the CMOS analog circuits can be designed with the minimum-gate-length of the fabrication process in the alpha-power law MOSFET model, the length of a MOSFET gate has been chosen to be a larger scale than the minimum-gate-length in the conventional Shockleypsilas square model. In this paper, we describe a 6-b 100 MSPS CMOS current steering digital-to-analog converter (DAC) with the alpha-power...
Timing-error detection and recovery circuits are implemented in a 65 nm resilient circuit test-chip to eliminate the clock frequency guardband from dynamic supply voltage (VCC) and temperature variations as well as to exploit path-activation probabilities for maximizing throughput. Two error-detection sequential (EDS) circuits are introduced to preserve the timing-error detection capability of previous...
For several decades, the output from semiconductor manufacturers has been high volume products with process optimisation being continued throughout the lifetime of the product to ensure a satisfactory yield. However, product lifetimes are continually shrinking to keep pace with market demands. Furthermore there is an increase in dasiafoundrypsila business where product volumes are low; consequently...
This paper presents an innovative structure based on 3 dimensional integration technology, where ultra thin inter layer dielectric enables a dynamic threshold voltage (VTH) control. A sequential process flow is proposed to fabricate 3D devices with dynamically tunable VTH. This ability can be exploited to design SRAMs cells with increased stability and surface density compared to planar technology...
This paper presents the probabilistic logic model to compute the probability distribution of the nano gate states. The characterization is based on the Markov random field and statistic physics. The primary logic gates are probabilistically characterized. The effectiveness of the method is demonstrated by a full adder and an 8-bit adder. The analysis shows that the device probability distribution...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
The paper presents the design and implementation of input/output interface circuits, fully compatible with low-voltage differential signal (LVDS) standard. Due to the low voltage differential transmission technique, the low power consumption and high transmission speed are achieved at the same time. The transmitter is implemented by a closed-loop control circuit and an internal bandgap voltage reference,...
In this paper, a novel double-square-ring slot electromagnetic band-gap (EBG) structure is proposed and designed in the power plane to suppress the ground bounce noise in high-speed circuits. The electromagnetic full-wave simulation and the measured results which agree with each other, show an ultra-wide band suppression of the ground bounce noise, ranging from 1GHz to 7GHz. The impact of the DSR...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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