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IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 5 > 1385 - 1395
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 5 > 1373 - 1377
IEEE Transactions on Plasma Science > 2010 > 38 > 8-1 > 1731 - 1738
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 4 > 2276 - 2282
IEEE Electrical Insulation Magazine > 2010 > 26 > 4 > 16 - 26
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 3 > 1940 - 1943
IEEE Transactions on Power Delivery > 2010 > 25 > 1 > 367 - 377
IEEE Transactions on Power Electronics > 2010 > 25 > 6 > 1460 - 1470
IEEE Transactions on Power Electronics > 2010 > 25 > 11 > 2828 - 2834
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 3 > 2142 - 2145
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 3 > 1924 - 1927
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 3 > 676 - 679
IEEE Transactions on Circuits and Systems I: Regular Papers > 2010 > 57 > 10 > 2815 - 2821
IEEE Transactions on Plasma Science > 2010 > 38 > 8-1 > 1726 - 1730
IEEE Electrical Insulation Magazine > 2009 > 25 > 4 > 6 - 13
IEEE Transactions on Applied Superconductivity > 2009 > 19 > 3-2 > 1344 - 1347
IEEE Transactions on Power Delivery > 2009 > 24 > 2 > 679 - 686
IEEE Transactions on Industrial Electronics > 2009 > 56 > 5 > 1420 - 1427
IEEE Transactions on Industrial Electronics > 2008 > 55 > 3 > 1470 - 1477
IEEE Transactions on Applied Superconductivity > 2008 > 18 > 2 > 713 - 716