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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 9 > 1492 - 1500
IEEE Transactions on Applied Superconductivity > 2012 > 22 > 3 > 4301304
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 4 > 650 - 659
Journal of Wuhan University of Technology-Mater. Sci. Ed. > 2012 > 27 > 1 > 96-99
Journal of Prosthodontics > 20 > 7 > 517 - 522
Journal of Biomechanics > 2011 > 44 > 14 > 2584-2587
International Endodontic Journal > 44 > 9 > 817 - 826
Journal of Morphology > 272 > 2 > 169 - 179
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 3 > 359 - 366
IEEE Sensors Journal > 2011 > 11 > 4 > 862 - 868
IEEE Transactions on Dielectrics and Electrical Insulation > 2011 > 18 > 1 > 81 - 88
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 35 - 43
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 3 > 344 - 351
IEEE Transactions on Magnetics > 2011 > 47 > 5 > 1402 - 1405
Journal of Microelectromechanical Systems > 2011 > 20 > 3 > 774 - 784
IEEE Transactions on Applied Superconductivity > 2011 > 21 > 3-2 > 1876 - 1879
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 171 - 178
IEEE Transactions on Applied Superconductivity > 2011 > 21 > 3-3 > 2605 - 2608
IEEE Transactions on Applied Superconductivity > 2011 > 21 > 3-3 > 3025 - 3028
IEEE Transactions on Applied Superconductivity > 2011 > 21 > 3-2 > 2304 - 2307