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With the exponential growth of devices connected to internet, manage the security of networks becomes as a difficult challenge for network administrator. Maintain and secure a heterogeneous network on a large scale is a complex task. In this context, the new paradigm Software Defined Networking (SDN), offers many possibilities and provides the potential to address those challenges. In this paper,...
Ordering events in a distributed systems consists fundamentally in delaying event delivery. Partial ordering, such as FIFO and causal order, has many practical usages in distributed systems and can be obtained in arbitrarily large and dynamic networks. However, partial orderings imply that messages cannot be sent and delivered as soon as produced. In this paper, we examine the latency induced by such...
Waste management is a major concern of the various policy makers, economic and social. It is present each time he comes to launching development projects and / or development of urban infrastructure. The implementation of Data Warehousing assisting in decision making in this context, proves very useful, but at the same time a very complex task. We provide a solution to support Data Warehouse design...
Fault tolerance is one of the most important requirements in the Wireless Sensors Networks (WSNs). In fact, the performance and the reliability of a RCSF degrade because of several factors. On one hand, the interferences between simultaneous transmissions generate infinite phenomena of collision / retransmission. On the other hand, the failure of some components of the network may introduce the failure...
Not all header fields in IP packets are used simultaneously during transmissions. Some fields may provide traceback services, especially for the defense against DDoS attacks. In this paper, we analyze which IP header fields may be used without impacting the other services provided by the IP protocol. We also analyze how unused fields can be filled for the purpose of traceback, and with what probability...
Network virtualization allows to establishing multiple independent logical networks through resource sharing of the underlying substrate network. To ensure optimal deployment of virtual networks, one has to find an effective mapping between logical resources claimed by the virtual networks and the physical resources belonging to the substrate network. This mapping problem, called VNE (Virtual Network...
In the seek of getting better sensibility, selectivity, times of response and recovery, interdigital electrode structures have been increasingly used in nano and microelectronic devices designed to the gas sensing, in the last decades, given their importance and performance characteristics presented for each new usage. In this sense, this work not only addresses on a review of performed researches...
A microridge-like structure was prepared on the surface of a c-Si substrate with Au hard-masks by reactive ion etching and their application to CIGS photovoltaic devices. Compared to the planar and microridge-like structures. It can be clearly seen that the CIGS films peeled off from the Mo/polishing planar Si substrates. Hence, the microridge-like Si substrate can enhance the adhesion between CIGS...
The particular opto-electronic properties of chemically synthesized colloidal nanoparticles can be promising for functional materials, as those required for high efficient photovoltaic (PV) devices. In particular, appropriately-designed semiconductor colloids (quantum dots, QDs) can potentially allow sub-bandgap current generation in intermediate-band solar cells; while metal nanoparticles (MNPs)...
Hybrid organic-silicon solar cells are promising candidates for next-generation photovoltaics due to their low fabrication cost and scalable roll-to-roll processes. However, the power conversion efficiency (PCE) cannot compete with those of traditional silicon solar cells yet mostly due to surface reflection and interface recombination losses. In this work, we investigate the sidewall profile and...
Two-dimensional (2D) semiconductors are of interest for numerous device applications, as they can provide excellent scalability and ease of integration onto arbitrary substrates and high performance transistors have been demonstrated with various 2D materials [1–2]. In particular, MoS2 and black phosphorus (BP) are both promising 2D materials for use in metal-oxide-semiconductor field-effect transistors...
In conclusion, we demonstrated the fabrication and I–V characteristics of HfS2 FETs. For the channel thickness of less than 7.5 nm, a clear saturation behavior and drain current of 0.2 µA/µm were observed with reasonably good on/off current ratio. These results provide basic knowledge of HfS2 as a channel material for FET.
In this work we report 23% increase in efficiency of n-i-p a-Si:H cells using Si, InN and Au nanoparticles. These cells shows an average improvement of 24.54% in short circuit current. The coated cells also reduce the reflection by 2.7% compared to reference cell between 300–800 nm, which indicates light is getting scattered by these nanoparticles. EQE and IQE analysis show that the overall enhancement...
Metal-assisted etching can be used to etch high aspect ratio structures in silicon (Si) wafers. Using Au as catalytic metal, we have developed a simple and robust technique which allows very high aspect ratio structures to be etched on n-type <100> substrates. For example, arrays of hundreds of narrow (10µm) and long (85mm) trenches can be etched completely through a 650µm thick wafer in order...
Nous nous intéressons au problème d'identification de la nature du bruit à partir de l'image observée en vue d'appliquer l'algorithme de traitement ou d'analyse le mieux approprié. Nous nous limitons ici à l'identification des bruits additifs et multiplicatifs. Pour identifier ces deux types de bruit, nous proposons une nouvelle approche qui consiste à caractériser chaque classe, et par consequent...
RF-MEMS filters will substitute conventional filters as they offer better performance at optimum cost. A bandpass filter is one such filter which is designed using microelectro-mechanical systems (MEMS) technology which have low insertion loss, high quality factors, good temperature stability and have various unique advantages. This paper reports on the implementation of wide bandpass filter using...
This paper will present wafer level packaging approaches and results for MEMS encapsulation and integration applied to resonators. The core technologies involve interposer fabrication with Through-Silicon Vias (TSV), temporary wafer bonding for thin wafer handling and wafer bonding for metallic sealing under vacuum and for formation of electrical interconnects. Seal rings based on AuSn metallurgy...
We present a new type of acoustic resonator technology aimed to undoing the technological locks encountered during the realization of capacitive silicon MEMS resonators exploiting true Bulk Acoustic Wave resonances instead of structural ones. The single-crystal silicon resonators are driven through a combination of a static bias and dynamic voltage applied across a 700 nm-thick electrostatic gap parallel...
In this work, reliable electric interconnection for MEMS/NEMS devices was realized by Au/a-Si (amorphous Si) and Au/c-Si (single-crystal Si) eutectic reaction in anodic wafer bonding process. We measured different resistances of di fferent bonding areas under different bonding temperature. When bonding temperature is under 370 °C, the resistance of the different areas (from 200 µm2 to 1000 µm2) fluctuate...
In this paper, a gold nano-dot (Au-ND) is successfully prepared on a silicon tip apex for scanning Kelvin probe microscopy (SKPM) applications. An extra facile localized fluoride assisted Galvanic replacement reaction (LFAGRR) is proposed to replace the silicon (Si) atoms at the tip apex with Au ones. We successfully fabricated Au-ND coated tip apex by tapping the Si tip apex against a thin layer...
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