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This work reports on the design, the modeling, the simulation, the integration strategy and the preliminary test results of a new variable capacitor using large variation of permittivity obtained by tuning the density of oil-in-water droplet produced with a microfluidic circuit.
We report on micro-machined flow-rate sensors as part of autonomous multi-parameter sensing devices for water network monitoring. Three different versions of the flow-rate sensors have been designed, fabricated and experimentally characterized. Those sensors are made of identical micrometric platinum resistors deposited on two different substrates-glass and silicon with and without insulation layer...
This article discusses application of photovoltaic panels thermal features into complex numerical model. Heating of the panels affects power output and efficiency. This process depends on weather conditions including fast variations of solar radiation. Typical models of PV systems do not speculate about these fast changes. Analysis and simulation of this transient phenomenon is result of this research...
A series of single-phase water microgap cooling experiments (gap height: 200 μm) are conducted on via arrays in 400 μm thick glass interposers. Surface temperature rise is compared to trials run with bulk Si of the same thickness. The results show that the copper vias are necessary to control the temperature rise of the glass substrate, and that while the via-enhanced interposers do exhibit a larger...
Solar radiation represents one of the most accessible within renewable energy sources. The rapid scaling-up in the number of installed photovoltaic (PV) systems is accompanied by an increase not only in the size of the associated investments and opportunities but also of the related risks. In this context, the study of the environmental effects which may bring to a decrease in their performance during...
We demonstrate a bonding method for combining silicon and quartz glass wafers using a sequential wet chemical surface activation (i.e., SPM→RCAl cleaning). After a multistep post annealing at 200°C, strong bonding with no voids or microcracks was obtained. Based on the detailed surface and bonding interface characterizations, a bonding model was developed to gain insight the low-temperature bonding...
In the previews study, we have proposed the room temperature bonding method for polyimide (PI) films and glass wafers that enables debonding even after high temperature process at 400 °C. However, the mechanism that the bond strength was affected by heating was not clear. In this work, we investigated the relationship between the heat treatment and the bond strength of PI films and glass wafers. From...
For the first time, this paper investigates anodic bonding using the latest chemically-strengthened glass called Gorilla Glass (from Corning). Gorilla Glass has many excellent properties for MEMS/NEMS applications, including hardness (resistance to scratching), flexibility, high fracture toughness and antibacterial resistance. However, the high thermal expansion coefficient of Gorilla Glass (7.58ppm/°C)...
Warpage suppression of FO-WLP during the fabrication process on the support was studied in the view point of material properties of temporally adhesive. It was found that Young's modulus of the temporally bonding adhesive influenced the warpage significantly and using that of small Young's modulus could suppress the warpage.
Through via formation is definitely the key for coming the advanced packaging which includes heterogeneous integration and high speed wireless communication. Glass and fused silica are well known as a great candidate for a core material for high frequency application as a result of high bulk resistance and lower dielectric loss. One of the important subjects in order to use through glass vias (TGV)...
Sub-micron wide Si rib patterns with a smooth sidewall and a high aspect ratio have been successfully formed using originally developed dry-etching apparatus with a high-density inductive coupled plasma source. The developed technique is applied for MEMS and X-ray devices.
As electronic products becomes smaller and thinner with increasing number of functions, the demand for high density and high integration becomes stronger. Glass has many properties that make it an ideal substrate for high integration substrate such as; ultra high resistivity, adjustable thermal expansion (CTE) high modulus, low dielectric constant, low dielectric loss and manufacturability with large...
Leading-edge technology integration, high-bandwidth and low-power data access call for vertical stacking of semiconductor devices with very fine pitch interconnects. To address this demand, a unique technology referred to as Direct Bond Interconnect (DBI®) which was invented by Ziptronix [1] is being further developed for die to wafer applications. By joining the dielectric regions and the metal interconnect...
Significant advances have been made to lower the power consumed by active and passive components, a lot of integration still happens either on-chip or on PCB. On-chip RF integration, also known as RF system-on-chip (SoC), achieves miniaturization on silicon substrate but is expensive and results in higher loss, especially for analog RF signals. On the other hand, integration at the PCB-level sacrifices...
Laser releasable temporary bond/de-bond (TBDB) materials we recently developed are described. Our laser TBDB materials are composed of two parts: release layer materials and adhesive layer materials. Release layer materials, which are essential for laser TBDB process, are designed to absorb UV laser such as 308 or 355 nm in wavelength. The de-bonding mechanism using such UV laser is based on direct...
Si single crystal stripe on bended glass substrate was fabricated by micro-chevron laser beam scanning method. The single crystal stripe had a dimension of about 6 μm in width and several hundreds of microns in length. The crystal quality was evaluated by EBSD, to reveal that the crystal orientation rotated about the transverse direction in forward direction, and only Σ3 and Σ9 coincidence site lattice...
In this study, a micro-probe electrode array with independent interconnections through the substrate has been developed using LRS(Low Resistance Silicon) via and glass reflow process. The silicon vias have electrical resistance less than 2 Ω because the boron ion in the borosilicate glass wafer can diffuse into the LRS pillars during glass reflow process. The LRS wafer was etched with double DRIE...
We present a novel μrespirometer to determine the oxygen consumption rate (OCR) of mammalian cells. The oxygen concentration is measured with the fluorescent dye PtTFPP in a polystyrene-matrix. This film is integrated into a closed microfluidic chip made out of only oxygen-impermeable materials like glass and silicon. This results in a low drift and thus allows long-term measurements with living mammalian...
Through glass vias (TGVs) are a key component in glass-based interposers and microelectromechanical-system lid wafers. Magnetic-field-assisted self-assembly has been demonstrated earlier in fabrication of through silicon vias. Here we present an entirely maskless TGV fabrication process utilizing magnetic assembly. Femtosecond laser is used for ablative direct patterning of surface metal layers and...
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