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A finite element method involving Johnson-Cook material model and fracture criterion was used to simulate the serrated chip morphology during high speed machining AISI 4340 hardened steel in different rake angles using commercial FE software ABAQUS. The effects of rake angle and chip morphology on cutting force were discussed. The investigation indicates that the simulation results are consistent...
Many of numerical analyzes of bulge forming processes have concentrated exclusively on the behavior of the deforming tube, with little analysis of the die behavior during the process. Finite element models have been developed to simulate axisymmetric tube bulging, with particular emphasis on the state of stress and deformation of the die. The effects of using internal pressure alone and combined internal...
The finite element method utilizes a piecewise solution to simulate the impact event. True stress and true strain at different strain rates must be used in order to adequately describe the material parameters. In this paper, a method is presented to obtain steel platepsilas true stress-strain curves. And those curves are used in an off-road vehiclepsilas 40% offset-barrier impact. Correlation of the...
Due to the smaller size of HDD, fault deformation of solder bumps is found more often. In order to study about a factor relating to fault deformation of solder bumps, the FEM is used to investigate stress performance. The results show that a small number of bumps positioned in a symmetric form have similar stress while a small number of bumps positioned in the asymmetric form have different stress...
A polarizing plate, which is an important part of a liquid crystal display panel (LCD), is made by sandwiching an organic polarizer between protecting films. An organic polarizer is both a hygroscopic and orthotropic material. The hygroscopic swelling and drying shrinkage of the organic polarizer can cause the polarizing plate to crack and the liquid crystal display panel to warp. The diffusion coefficient...
A nondestructive evaluation system for detecting delamination between a chip and micro bumps in 3D-stacked structures is indispensable for highly reliable and low-cost manufacturing. In stacked structures, it is hard to inspect the adhesion condition of metallic bumps that connect a lower chip with an upper chip because most of the bumps are invisible. We have, therefore, proposed a new nondestructive...
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