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Materials Chemistry and Physics > 2016 > 169 > C > 82-88
Journal of Alloys and Compounds > 2016 > 654 > C > 529-533
Microelectronics Reliability > 2016 > 56 > C > 66-72
Journal of Alloys and Compounds > 2015 > 651 > C > 42-48
Journal of Physics and Chemistry of Solids > 2015 > 87 > C > 32-37
Materials Research Bulletin > 2015 > 71 > Complete > 61-66
Journal of Alloys and Compounds > 2015 > 645 > C > 118-124
Journal of Alloys and Compounds > 2015 > 643 > C > 94-99
Journal of Alloys and Compounds > 2015 > 642 > C > 40-44
Journal of the Mechanical Behavior of Biomedical Materials > 2015 > 49 > C > 269-276
Materials Chemistry and Physics > 2015 > 162 > C > 88-93
Thin Solid Films > 2015 > 586 > C > 1-7
Journal of Alloys and Compounds > 2015 > 620 > Complete > 185-191
Journal of Alloys and Compounds > 2015 > 619 > C > 861-868
Journal of Alloys and Compounds > 2014 > 616 > C > 646-651
Journal of Alloys and Compounds > 2014 > 615 > Supplement 1 > S90-S92
Journal of Alloys and Compounds > 2014 > 615 > Supplement 1 > S375-S381
Journal of Alloys and Compounds > 2014 > 615 > C > 629-635
Journal of Alloys and Compounds > 2014 > 615 > C > 440-445