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IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 1 > 90 - 100
IEEE Electron Device Letters > 2015 > 36 > 3 > 268 - 270
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 2 > 217 - 224
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 2 > 256 - 264
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 1 > 108 - 118
IEEE Transactions on Circuits and Systems I: Regular Papers > 2015 > 62 > 1 > 139 - 148
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2014 > 22 > 11 > 2380 - 2387
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 12 > 1936 - 1946
IEEE Electron Device Letters > 2014 > 35 > 6 > 660 - 662
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 5 > 294 - 296
IEEE Electron Device Letters > 2014 > 35 > 8 > 865 - 867
IEEE Transactions on Circuits and Systems II: Express Briefs > 2014 > 61 > 12 > 987 - 991
IEEE Transactions on Nanotechnology > 2014 > 13 > 3 > 488 - 495
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 4 > 697 - 707
IEEE Transactions on Electromagnetic Compatibility > 2014 > 56 > 5 > 1202 - 1209
IEEE Transactions on Electromagnetic Compatibility > 2014 > 56 > 3 > 646 - 652
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2013 > 32 > 8 > 1265 - 1273
IEEE Microwave and Wireless Components Letters > 2013 > 23 > 8 > 385 - 387
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 5 > 724 - 731