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MEMS components failure often happens where environment effects, such as shock, vibration, and temperature cycles. In this paper, the reliability of surfaces micro-machined polycrystalline silicon micro-cantilevers under shock loads was discussed. Using interference theory of stress and strength in the mechanical field, the reliability model was presented and it can predict the probability of the...
In this paper, we demonstrate a silicon-based packaging platform for a package component of light emitting diode (LED) by silicon bulk micromachining technologies and using a silicon substrate with embedded solder interconnections to dissipate heat and match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome LED life, high operating voltage, package degradation...
We present an ultra-precise optical methodology to investigate complex nano- and microscale structures fabricated by micromachining. This method is applied for micromachined tunable multiple air-gap GaInAsP microresonators as well as for Si cantilever arrays which are fabricated commercially. These different devices are applied in scanning probe microscopy, analytics, sensing and high bit-rate communication...
Micromachining conditions for silicon using a CW lasers and different gas ambients were reported. We report results of experimental investigation of the etch rate of silicon using a CW 532 nm laser in sulfur hexafluoride atmosphere, and three-dimensional temporal computer modeling of the process
The development of high quality 3C-SiC layers on Si free of residual stress opens the possibility to use SiC for microsystems fabrication and to combine them with Si devices for sensor applications. A new front-side micromachining process technology for 3C-SiC layers on Si resonators has been developed. To show it feasibility several resonator cantilever or bridge test structures of various dimensions...
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