The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Assembly of electronic components on rigid and/or flexible printed circuit boards is today the customary way to fabricate electronic systems in stationary, mobile and automotive applications. On the other hand, many of the demands from emerging application fields like wearable and textile electronics cannot be met if with standard technologies. These fields have therefore become mayor drivers for...
Future generations of electronic products require further developments of integration and packaging technologies. The reasons for this are higher signal frequencies and the increasing functional density at acceptable costs. With the existing technologies organic substrates with high-density built-up layers with microvias can be produced. On both sides of the substrates, passive and active components...
Surface treatment of tape substrates such as TCP (tape carrier package), COF (chip on flex) using atmospheric pressure low temperature plasma has been reported. Reliability issues of tape substrates, one of constituents of display devices, are getting more attention as device size get smaller and functions more complex. Resin pottability and ink printability of the tape substrates are improved by...
Summary form only given. Systems packaging is moving from the bulky and discrete systems of the past to integrated systems of the future with embedded functions from thin film functional component, thin core or coreless packaging substrates and fine pitch interconnections in organic package. Together with SiP modules nano IC devices, embedded power sources and user interface, this is expected to lead...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.