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As the device size downscales, hot carrier aging (HCA) scales up and remerges as a major challenge to the reliability of modern CMOS technologies. The conventional method for predicting the HCA device lifetime is based on a power law kinetics and critically depends on the accuracy of the time power exponent, n. In this work, we study how to extract the n accurately. It will be shown that the widely...
since the 21st century, as the global climate problem is rising, the energy problem has become more and more serious. This requires us to explore new clean energy sources. The development and utilization of new energy is not only can meet the needs of the rapid economic growth nowadays, but also is the inevitable choice of sustainable development strategy in our country. Now, comply with the integration...
Driving with shared control systems has been shown to be efficient in reducing collisions during a lane change. However, the ability of the current shared control systems is limited and their absolute reliability is not assured. The goal of this study is to determine how changes in system performance affect human-machine cooperation and safety. An experiment using a driving simulator was designed...
Scanning acoustic microscope (SAM) is widely applied to the screening and detection of plastic encapsulated microcircuits (PEMs) because of its high sensitivity and nondestructive characteristic. However, existing methods uses SAM to focus on six interfaces one by one, which is time consuming and inefficient. In this paper, based on the analysis on defects of PEMs and discussion about existing SAM...
Sintered Ag has gained attention as a replacement for high lead applications due to its high thermal, electrical and reliability performance. Today, the temperature requirements for certain business units require higher levels of capability. Coupled with the pressures of converting to lead free, a feasible solution needs to be reached soon. This led to the formation of the DA5 (die attach 5) consortium...
Productivity improvement in manufacturing is always the key focus to strengthen an enterprise cost position to stay ahead of competition. In semiconductor manufacturing, improve the cost position through faster machine speed, reduce man to machine ratio, utilization of material efficiently, increase the through put per fix process cycle, and etc. are the common practices. In this paper, cost improvement...
Packages of power semiconductors have considerable influence regarding the thermal impedance, the parasitic inductance, which affects the switching losses, and the reliability. In this paper, the performance of a phase leg of a PFC rectifier with PCB embedded power semiconductors is investigated. The mechanical stress in the PCB is analyzed by a FEM simulation and PCB design guidelines are given....
In this work, an n-layer screen printed ceramic on stainless steel based pressure sensor has been designed, fabricated, and characterized as the foundation for high pressure and harsh environment applications. A few layers of dielectric ceramic films were deposited on a thin and flexible stainless steel diaphragm by screen printing and firing. Finite element analysis (FEA) method has been used to...
The effects of zinc-oxide/salt with different contents in the aluminum soldering flux on the interfacial microstructure of Sn-0.7Cu/6061Al and mechanical property of 6061Al/Sn-0.7Cu/6061Al joints were investigated. Results show that the flux containing zinc-oxide and zinc-salt can effectively remove the oxide film on surface of 6061Al and result in formation of corrosion pits at the interface of the...
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The...
Copper wire is increasingly used in microelectronics because of its low cost, higher stiffness and better electrical and mechanical properties. However, there are some concerns on wire neck crack, wedge bond crack, and corrosion during reliability testing, especially wire neck crack under thermal cycling test (TCT). It is important to understand failure mechanism of Cu wire crack so that approach...
Through Silicon Via(TSVs) technology is one of the most prominent feature in future microelectronic devices packaging. Since TSVs contain the interfaces of heterogeneous materials that have high CTE mismatch, and would hence produce large thermal stresses under temperature loading, often leading to mechanical failure. A failure stress mathematical model is established and the algorithm of mathematical...
In this study, Sn/Cu soldering interface and the growth characteristics of IMC grains were in-situ investigated. High-pressure air (0.8MPa) was used to blow away the residual liquid solder on the Cu substrate at different soldering temperatures (250 ° C, 275 ° C, 300 ° C) and different soldering time (10s,30s,60s,120s), thereby obtaining the unobstructed view for growth morphology of IMC in the heating...
The effect of Pb content on fatigue life of mixed SnAgCu-SnPb solder joints was investigated by thermal cycling with temperature ranging from −55°C to 125°C (with 10 min dwell times and 10°C/min ramp rate). The cross-sections of mixed solder joints were characterized by scanning electron microscopy equipped with energy dispersive spectrometry. The results showed that the thermal fatigue life of Sn3...
The effect of electric current density on the creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads was investigated in this study. Results show that all solder joints exhibit similar creep curves displaying typical three-stage creep characteristics regardless of the current density, which suggests that mechanical stress is...
In this paper, the relationship between resin content and the PCB warpage and anti-shock performance of lead-free solder joint was investigated. In order to measure the warpage of PCB during reflow progress, thermal shadow Moiré method had been used. Thermal shadow Moiré was an optical noncontact method to measure warpage using a Moiré fringe pattern resulting from the geometric, interference between...
The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring...
With the advantages of non-contact, flexible, high energy density and local heating, the laser jet solder ball bonding (SBB) technique is widely used in electronic packaging. The reliability of laser jet SBB solder joints has long been concerned. As is well known, the wettability (i.e., the spreading ability) of the molten solder on the boding pad is a key factor influencing the formation and performance...
Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance...
With the decrease of the size of lead-free solder joints, the reliability of solder joints is particularly prominent, which is critical to the mechanical behavior of solder joints. While in the actual production process, the stresses for solder joints are often complex. In this paper, the nano-indentation is used to obtain the mechanical behaviors and the step behaviors of Sn3.0Ag0.5Cu and Sn0.3Ag0...
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