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Ag finish is a low cost and low resistant solution comparing with Au finish in electronic packaging. For the sake of application of Ag finish, the solder joint reliability with broad silver finish designs on PCB of packaging is studied. It is found that both finish structure and process affect the reliability. Electro-less Ni/Pd/immerging Ag (ENEPIS) has the best integrated solder joint performance...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0∼2000Hz...
In this study, the formation mechanisms of Kirkendall voids in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joints were investigation, and the coupling effect of joint size and Kirkendall voids on the fracture features of Ni/SnAgCu/Cu joints were also studied. It was found that the size effect had a significant influence on the formation of Kirkendall voids at Cu side in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joint,...
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. SnPb was included as a control. The findings are as follows: (1)...
With the development of lead-free in electronic products, mixed soldering of lead-free component with lead solder is inevitable in high reliability electronic assembly. For the mixed assemblies, the primary task is to ensure the reliability of mixed solder joints. This study is aimed at finding out the harmonic vibration fatigue properties of plastic ball grid array (PBGA) mixed solder joints under...
POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage...
In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately. In this paper, a predict method...
3-D finite element models of SOP (Small Outline Package) were constructed, in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numeri3cal simulation was performed with three kinds of lead...
Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. The void of the solder joint has a significant influence on the CCGA package reliability. This paper introduced two reflow processes...
Based on the JEDEC standard, the three-dimensional finite element model of board level VFBGA package components was established, and the reliability of low silver lead-free solder Sn0.3Ag0.7Cu under drop impact was observed. The results show that, the mechanical impact and bending of PCB caused by mechanical shock are the main reasons which induce the drop failure of solder joint in the drop impact...
The continuous downsizing of solder interconnect will significantly affect the wetting reactions between solder balls and pads and the cross-interaction of opposite heterogeneous pads, which further affects the reliability of the interconnect. In the present work, Cu/Sn-3Ag-0.5Cu/Ni-P solder interconnects with ball diameters of 200, 300, 400 and 500 μm were reflow soldered to study the size effect...
This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
The compact and high-performance Lead-free BGA device has become the modern highly integrated device which is required in electronics assembly. In the course of service, they experience thermal cycling and become invalid. The failure mode of BGA device, which has undergone the thermal cycling, is investigated by scanning electronic microscope, electron back scattered diffraction and micro Vickers...
Lead-free solder alloys are more easily oxygenized and have poor wettability compared to traditional Sn-Pb solder alloys, which affects solder joints reliability. Ar is the most plentiful rare inert gas. It has been accepted that, in Ar atmosphere, the oxidation of lead-free solder joints can be prevented and the wettability of lead-free solder joints can be improved. To date, however, few systemic...
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