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Microbumps are widely used to interconnect stacked chips with through-Si-vias (TSVs) in vertical direction to enable 3D IC integration. Several recent studies reported [1, 2] that a unique porous void formation was found in Cu-Sn microbump particularly in Cu3Sn layer. This porous Cu3Sn formation was only reported in microbump which has constrained joint thickness (
Joint properties of a La2O3-nanoparticle-added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder were investigated in this study. Nano-composite solders which contain second-phase nanoparticles in the solder matrix are known to possess high mechanical strength and creep resistance. In this study, La2O3 nanoparticles were mixed with a Sn-Ag-Cu solder paste and the solder joint properties as well as the process...
The use of sensors has significantly increased in both domestic and industrial applications. In some applications, the sensor component is used along with a heat-sensitive component, therefore, the attachment process using common lead-free solders that have high melting temperature (e.g., Sn-Ag-Cu, Tm = 217 °C) may be challenging. Among lead-free solders with low melting temperature, Sn-8%Zn-3%Bi...
As three-dimensional Through-Silicon Via (3D-TSV) packaging is emerging in the semiconductor market to integrate multiple functions in a system for further miniaturization, thermal compression bonding (TCB), which stacks multiple bare chips on top of each other with Cu pillar bumps with solder cap, has become an indispensable new packaging technology. The novel non-conductive film (NCF) described...
In the electronic industry the portable devices are becoming the prime factors to dominate the market share. And with the blessing of miniaturization, these devices are also becoming smaller and smaller day by day. On the other hand, with this miniaturization process these devices are becoming more susceptible to drop impact loading. To ensure product quality and to integrate more complicated functionality...
In this paper, solder joint reliability of a Chip Scale Package (CSP) with polymer core solder balls (PCSB) was evaluated. Temperature cycling data was obtained from both conventional and polymer core balls tested on chip scale package with pitch 0.5mm mounted on an 8 layers HDI board. FEM simulation was also performed to compare the polymer core balls with a conventional solder ball. This study has...
This paper presents a comprehensive study on the reliability of QFN components for aerospace applications, particularly the impact of conformal coatings on the reliability of such QFN assemblies was investigated. Both experimental and computational modeling techniques are discussed. In the experiments, several types of plastic and ceramic QFNs assemblies were subjected to accelerated thermal cycling...
Multi-terminal passive components like interdigitated capacitors (IDCs) are a key enabler for power supply decoupling and controlling transient chip responses at high frequency for improved performance and functionality. To ensure higher performance is achieved, the integrity of the solder joint connecting the passive component to the organic build-up substrate in a flip chip ball grid array (FCBGA)...
The constitutive relations commonly used to model the behavior of SnAgCu solder joints in thermal cycling predict strain rates that are wrong and may be extremely misleading, particularly regarding their dependence on stress. Previous work has already shown cycling induced coarsening to lead to order of magnitude changes in strain rates, and it appears that cycling leads to a change in the dominant...
The through-silicon-via (TSV) technology is one of the most effective approaches to fulfill the form factor, profile, performance, and 3D interconnect demand of next generation handheld and wearable electronics. The TSV technology has been developed into two categories, the TSV Last and the TSV Middle. In this article, we examined a variety of aspects of the two TSV technologies when applied to 3D...
Board-level thermal cycling reliability performance of two buckets of discrete power packages is evaluated by both Finite Element Analysis (FEA) and an actual test. One bucket consists of smaller size packages and the other consists of bigger size packages. The testing condition follows the established industry standard, IPC-9701, with a temperature range of 0°C ~ 100°C. In FEA modeling, the fatigue...
The production of reliable power modules capable of achieving higher power densities and higher junction temperatures is limited by the present assembly and packaging methods, mostly in the areas of the die-attach and the top level interconnections. The resultant bondline consists of intermetallic compounds with higher melting point than the used interlayer material, thus making this technique applicable...
High density I/O (Input/Output) with close proximity communication between dies in 2.5D heterogeneous integration of disparate ICs (Integrated Circuits) requires substantially miniaturized interconnect. Micro-bump consists of down sized Cu pillar and solder is the chosen interconnect technology for die stacking volume manufacturing. The interconnect solder bump height is shortened to less than 20µm...
This paper theoretically and experimentally assesses the board-level reliability of glass-based 3D Integrated Passive Device (IPD) with TGV-based inductor capacitor (LC) filters in thermal cycling test. Important failure modes such as wellknown solder joint cracking and TGV failure as well as other failure modes such as glass cratering are investigated in this work. Through finite-element modeling,...
The solder joint reliability under thermomechanical fatigue is a very strong function of package size and thermal expansion mismatch for a large ceramic leadless chip carrier package (CLCC) with perimeter I/O. If these factors cannot be adjusted, the design space for successful implementation of such a package becomes drastically small. We discuss the reliability improvement methodology where the...
Three-dimensional integrated-circuit (3D IC) is one of the most important electronic packaging technologies nowadays. Cu-to-Cu through-silicon-via interconnection is a crucial process in 3D IC. Direct Cu-to-Cu bonding has been a challenging process for the industry due to its strict requirements on processing conditions and corresponding high processing costs. Micro-bumping is a widely used method...
Electronic control units (ECUs) in automotive industry are exposed to extreme harsh electrical and physical working conditions. Moreover, due to the continuous innovation in automotive industry, complexity and miniaturization of these systems are increasing. Beside the environmental factors, there are other new requirements facing the electronic components reliability in automotive industry accompanied...
Reliability specifications for solder joints, as well as for all electronic components, have become a fundamental feature in the qualification of an electronic product. The relevance of these reliability features increases if new components or materials are considered. In this research activity, an accelerated thermal test on customized electronic boards was implemented for an early reliability evaluation;...
This paper first presents packaging technology trends and accelerated reliability testing and life projection methods that are being practiced by industry. Specifically, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages and approaches for characterizations of assemblies under accelerated thermal loading. Examples...
An analytical stress model is developed for a short cylinder (beam) with clamped and offset ends. The offset is caused by an external lateral force that has to be determined from the known offset. It is envisioned that such a beam can adequately mimic the stresses and strains in a column of a column-grid-array (CGA) solder joint interconnection. Such an interconnection is characterized by an elevated...
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