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Real-time monitoring of temperature has become crucial in cases like server room, incubators of infants in hospitals, coal mines, green houses etc. In all these cases we prefer a temperature sensor which ensures user's safety, proper alarming conditions, be simple to use (user friendly), easy calibrations, small and light weight, inexpensive and effective. The aim of this system is to provide an effective...
This article shows that using a piezoelectric motor in a mecatronic system, the thermal management is not an issue, as for conventional electromagnetic motors. We then show that choosing a motor on the maximal velocity or force/torque required in the application is not sufficient, and the motor selected may not be able to perform the motion profile. We then propose a selection procedure based on the...
In this work, a statistical electro-thermal analyzer with high compatibility of power model is developed. The developed analyzer takes both the easily implementing advantage of Monte Carlo method and the fast convergent advantage of stochastic analysis method to effectively solve the statistical electro-thermal problem. Experimental results indicate that the developed electro-thermal analyzer can...
Three-dimensional (3D) technology offers greater device integration, reduced signal delay and reduced interconnect power. It also provides greater design flexibility by allowing heterogeneous integration. In this work, a 3D thermal model of a multicore system is developed to investigate the effects of hotspot, and placement of silicon die layers, on the thermal performance of a modern flip-chip package...
Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly...
Development and validation of a dynamic model focused on thermal aspects of the integrated propulsion system (IPS) on a notional all-electric ship (AES) is presented. This model serves as a baseline for investigation of thermal management technologies and architectures focused on identifying tradeoffs, improving system-level efficiency, and increasing the performance of an AES. The IPS model includes...
The micro-pin-fins prepared on the back side of the power chip enable heat removal on the level of modern microsystem demands. Carbon nanotube (CNT) has been proven to be a potential material for micro-cooler because of its superior advantages including high thermal conductivity, good mechanical property and so forth. And there emerges various applications of CNT in the micro-cooler system. In the...
Active heat dissipation method plays a vital role in thermal management of high power light emitting diode (LED) packaging. As a new cooling device, thermoelectric cooler (TEC) is applied in electronic packaging, for which the extensively applied devices are the heatsink and the fan by now. In order to evaluate the cooling performance of the heatsink and TEC, three different cooling models for light...
Simulation of thermal stresses in gold wires was rarely reported in previous days due to the difficulties in FE model building. In this study, the 3D modeling was performed to evaluate the thermal stresses in gold wires with the entire package model to identify which wires to peel when verifying the second bond. The FE model in this study included the wire loops and the second bond (stitch bond) geometries...
Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was greatly improved by the 3D packaging technologies. Package-on-package (POP) is one of the 3D packaging solutions. In the POP, the package components can be fully tested good prior to integration. However, the structure of POP is much more complex than that of single package...
Thermo-mechanical reliability for 3D stacked-die package with through silicon via (TSV) is studied through finite element simulation with sub-modeling technology, and design of experiments (DoE) using Taguchi experiments and analysis method. Firstly, the thermo-mechanical responses of micro-solder joints between stacked-die and copper via/SiO2 insulated layer structures are investigated under accelerated...
The following topics are dealt with: disruptive technology; semiconductor manufacturing: production scheduling; inventory management; production systems; information and communication technologies; sustainable manufacturing; life sciences; laboratory automation; industrial robots; green manufacturing; microrobots; nanorobots; automata; Petri nets; distributed systems; vision processing; image processing;...
As electronic devices become lighter, thinner, shorter, and smaller, IC packages follow. Low-profile type packages are reduced in thickness, so the stiffness of thin type packages is weaker due to the thermo-mechanical effects of manufacturing processes, testing, and operations. Due to the different temperatures in those processes, and the differences in coefficient thermal expansion (CTE) of each...
A comprehensive investigation has been carried out to develop nano-adhesive by studying the influences of post-treatment of carbon nanotue (CNT), dispersing parameter, CNT content and matrix on the adhesive performance. It has been found that both thermal resistance (Rth) and volume resistance reduced greatly by incorporating CNT into the epoxy. The uniform distribution of CNT has been achieved by...
High quality vertically aligned carbon nanotube (VACNT) arrays have been synthesized on bulk Al alloy (Al6063) substrates with an Fe catalyst using low pressure chemical vapor deposition (LPCVD). The pretreatment process of the catalyst was shown to play a critical role, and it was studied comprehensively and optimized to grow high quality VACNT arrays within a wide range thicknesses of catalyst layer...
Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the visco-elasticity and plateau are offered in terms of filler...
Thermal design is necessarily to be considered for high-power electronic packaging device design. In this paper, the thermal characteristic of packaging device was studied using FEM, for example, phase shifter and LED. The model for thermal condition of phase shifter was established. The top junction temperature obtained by simulation shows tendency as tested experiment results, verifying the correctness...
This paper presents the results of thermal performance and mechanical reliability co-design of flip chip devices by a comprehensive evaluation of package structure and material effects. The study provided valuable insights that can assist to identify potential package solutions and enhancement options by considering process, materials, thermal performance and mechanical reliability. With concurrent...
High power semiconductor laser arrays have been widely used in many fields, such as pumping solid state laser aerospace, industry, medicine and display. For many applications, high power semiconductor lasers operating quasi-continuous wave (QCW) mode are demanded. For QCW laser, the output peak power is higher and average power is low. Therefore, the transient thermal density is very high. The most...
Since radio-frequency microelectromechanial devices work mechanically, they are sensitive to thermally induced packaging effects. These effects will have impacts on their microwave performances and reliability. In this paper, the possible effect of the thermal stress and strain induced in die attaches process on the microwave characteristics of packaged distributed MEMS phase shifters is studied....
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