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In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the majority of active devices further away from the heatsink. This results in a degraded thermal path which makes it more challenging to remove heat from the active devices. Gradient HeatWave-3DIC was used to perform an appropriate 3D...
As the chips get denser and faster, heat dissipation is fast turning into a major problem in development of ICs. Nonuniform heating of chips due to hotspots is also an area of concern and much research. In this paper, we propose an adaptive method which takes advantage of the self-reconfiguration capability of modern FPGAs to mitigate hotspots. We adapt the floor plan of the IC in response to the...
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