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As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, the same thermal resistance limits the heat transfer for power component dissipation. The narrower the...
Thermal resistance of an electronic package is a measure of the package's ability to transfer the heat generated by the chip to the printed wiring board (PWB) or to the ambient. For a high performance flip-chip package, the primary heat transfer path for most applications is through a heat sink or cold plate attached to the package lid. Hence, a test method that evaluates the heat transfer path from...
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