The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper discusses the thermo-mechanical design and analysis of a large die FCBGA. This work focuses on co-design of the 1st level and 2nd level solder joint reliability analysis of a flip chip package emphasizing the effect of details substrate modeling and solder layout design. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate...
This work focuses on co-design of the 1st level and 2nd level solder joint reliability analysis of a flip chip package, with large die. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate. Two 1st level solder bumps are modeled along with the 2nd level solder balls. The fatigue life of 2nd level solder joint is estimated by the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.