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Recent advances in transportation and new energy fields such as electric vehicles and power trains requires integrated power modules with increasing power input/outputs with high reliability. The next generation of integrated power inverter would have multiple MOSFET devices for demanding operations, leading to unprecedented challenges in thermal management, materials and reliability. In this work,...
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20µm) and high aspect ratio (18∶1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm2 and resulting in junction temperatures below 50 °C.
An experimental apparatus was developed to characterize the performance of a thermoelectric module (TEM) and heat sink assembly when the TEM was operated in refrigeration mode. A numerical model was developed to simulate the experiments. Bulk and interfacial Ohmic heating, the Peltier effect, Thomson effect and temperature-dependent bulk material properties, i.e., Seebeck coefficient and electrical...
This paper seeks to demonstrate the performance of a thermoelectric energy recovery module (TERM). The TERM aims to convert the waste heat from power amplifier (PA) transistors into the useful power. The TERM contains a thermoelectric generator (TEG), a heat spreader, and a heat sink. A first order prototype of the TERM is generated and used as a test vehicle. Experimental setup mainly consists of...
Thermoelectric modules (TEMs) are solid-state devices used for cooling, heating and power generation. An experimental apparatus was developed to characterize the performance of a TEM and heat sink assembly, where the TEM is operated in refrigeration mode. A numerical model was developed to simulate the experiments. Bulk and interfacial Ohmic heating, along with Peltier and Thomson effects were modeled...
A nano-gap Pirani gauge for integration with bulk MEMS sensors and actuators was fabricated by cutting-edge high aspect ratio bulk micromachining. The 150nm-wide, 5000nm-dep vertical trench enables wide-range pressure measurement; the device showed sensitity in all the tested range from 6.3 to 101.3kPa. ??0.27% of power variation around 35 mW was measured for ??1 kPa of pressure change from atmospheric...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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