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Sensors and wearables that monitor physiological data in fitness and healthcare applications are becoming more and more popular. More particularly the use of high signal-to-noise ratio Silicon Photomultipliers (SiPMs) could represent a breakthrough in terms of enhanced detection capability and portability in many applications used for physiological signs monitoring such as Photopletysmography (PPG)...
On the benefit of the deeply development of MEMS and inertial instrument technology, the novel micro technology for positioning, navigation and timing (μΡΝΤ) becomes the substitution of GPS technology, and is the one of the most popular research area. The μ PNT unit volume can be pressed obviously by employing 3D stack technology after MEMS components are finished, and through silicon vias (TSV) technology...
A novel vibrating ring gyroscope is proposed in this paper, and the structure employs axisymmetric ring resonator and capacitance transducers. Motion characteristics of the ring resonator and the setting of the capacitance electrodes are discussed in detail. The simulation results demonstrate that the natural resonant frequency of the operating mode of the gyroscope is 8.805 kHz and 8.807 kHz, and...
This article aims to establish the economic contribution of a photovoltaic system placed on a façade of a building, replacing traditional elements such as windows and glass-cement walls with active elements. The aim is to compare the behavior of next-generation systems, which favor architectonical integration, with traditional ones. Two novel systems have been taken into account: a dye sensitized...
Multilayered structures with LT plates bonded to silicon or glass substrates via AlN, isotropic SiO2 or their combinations, were theoretically investigated as potential materials for resonators with high Q-factors required for the 5th generation of mobile communication systems. Characteristics of SH-waves propagating under Al grating in such structures, including electromechanical coupling and propagation...
Two-axis quasistatic gimbal-less microscanners were fabricated through the microassembly of a glass lid and stationary comb electrodes. The total optical scan angles were enlarged to 5.2° and 5.8° for horizontal and vertical scan axes, respectively.
Pb-free silver pastes based on SnO-B2O3 glass frits were synthesized and used for the front-contact electrodes of crystalline silicon (c-Si) solar cells. First, four kinds of SnO-B2O3 glass frits with different amounts of SnO were synthesized by a melt-quenching method, and four Ag pastes based on these glass frits were prepared correspondingly. Then, Ag pastes were printed on c-Si solar cells and...
Thin silicon or glass interposer provide a way to highly integrated microsystems [1]. In this work, we present a novel wafer-level fabrication method of RF interposer applied in the integration of band pass filter in the frequency range of X band. In order to reduce the insertion loss caused by parasitic effects in the substrate, a special designed TSVs transmission structure (a core TSV and six shielding...
MEMS atomic vapor cells have a large variety of applications in atomic devices such as chip-scale atomic clocks (CSACs), atomic magnetometers and atomic gyroscopes. We report here on the successful wafer-level hermetic sealing of such cells by Cu-Cu thermocompression bonding. This innovative method is used as an alternative to anodic bonding and allows to overcome some of its limitations. In particular,...
In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth Memory (HBM) is introduced to the market. HBM enables TeraByte/s bandwidth with extremely fine pitch, short interconnects using Through Silicon Via (TSV)...
Temporary bonding and de-bonding techniques using respectively spin-on glass (SOG) and hydrogenated amorphous-Si (a-Si:H) have been examined for multichip-to-wafer three-dimensional (3D) integration process. In this study, a 280 um-thick known good dies of 5 mm × 5 mm in size were temporarily bonded to a pre-deposited (a-Si:H (100 nm) and SOG (400 nm)) support glass wafer. After completing the die...
Fan-out wafer-level-packaging (FO-WLP) technology is developed with the advantages of smaller package size, higher Input/Output (I/O) counts, lower cost, and better performance. In this study, the FO-WLP technology is applied to TSV-less inter-connection technology of 2.5D IC packaging and a novel RDL-first wafer level packaging is demonstrated. Firstly, a pre-coated laser release layer at the interface...
A high thermal conductivity of the underfill material is key for efficient heat removal from 3D chip stacks. Recently, the excellent thermal properties of underfills in which nanoparticle self-assembly formed necks between the filler particles were demonstrated. To industrially apply neck-based thermal underfills, the robustness of neck formation must be improved. Accordingly, it is crucial to understand...
This paper presents, for the first time, a novel silicon damascene like via-in-trench (ViT) interconnect for panel-scale package redistribution layer (RDL) configuration. The panel scale damascene RDL in this paper comprises of ultra-fine copper embedded trenches and microvias with diameter equal to the width of trenches using a 5 µm thick dry film photosensitive dielectric. A 140 µm thick glass substrate...
As power demands for microelectronic devices continue to rise, new techniques for heat dissipation require innovative fabrication solutions such as on-chip cooling methods. The mechanical reliability of these high-powered, high-pressure systems is particularly sensitive to the interfacial strengths within the microelectronic architectures. In research at Georgia Tech, on-chip cooling methodologies...
In this paper, a fully BiCMOS integrated microfluidic technology platform for Lab-on Chip (LoC) applications is presented. Fusion bonding and adhesive bonding techniques are applied to realize a 3-wafer-stack integration. A glass wafer is used on top of the BiCMOS wafer and the Si channel wafer to enable simultaneous optical and electrical measurements. An alignment accuracy of less than 1 µm between...
Traditional IC packaging requires chips to be assembled at the same level, while recently thrived 2.5D/3D IC packaging utilizes skyscraper approach to stack various types of chips with diverse functions occupying similarfootprint, and this approach not only can reduce overall package size, but also can improve electrical interconnection performance. The primary difference between 2.5D/3D IC lies in...
The effect of glass type used as fan-out carrier substrate on the reliability of the electrical devices were investigated. Glasses with thermal expansion coefficient of around 6~8 ppm/K with and without alkali ions involved in the glass were tested. With using non-alkali type glass as the carrier material, it was confirmed that the lifetime of the test vehicles were longer than that heated with conventional...
A MEMS-based gas chromatograph (GC) front-end for a mass spectrometer has been developed for space applications. The GC uses Molecular Vapor Deposition (MVD) to achieve a uniform coating of the GC column. Particular attention has been paid to the fluidic connections of the MEMS to the external tubing.
A cost effective and reliable technology allowing extreme miniaturization of batteries into silicon, glass chips and electronic packages has been developed, employing a dispense-print process for battery electrodes and liquid electrolyte. Lithium-ion micro batteries (active area 6×8 mm2, 0.2–0.4 mAh) with interdigitated electrodes and glass housing were fabricated, tested and finally compared with...
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