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We developed a novel hybrid bonding technology for Au ultralow-profiled bumps and underfill resin with a modified “lock-and-key structure.” The lock structure interlocks with the key structure. We applied these structures to perform an entire adhesion between the mating surfaces in place of conventional underfilling technique. To fabricate the key structure, we developed a simple process that can...
Micro-nano structured silica particles were synthesized successfully by grafted 4,4'-diphenylmethane diisocyanate (MDI). We report a robust procedure for preparing superhydrophobic materials with the advancing water contact angle (WCA) of about 155°. Micro-nano structured surface roughness, which mimics the surface topology of self-cleaning plant leaves, originates from well-defined micro-nano structured...
Pulverized mold residue of cured epoxy molding compound was reused to produce poly (vinyl chloride) composites with the aim to recycle resources in a more profitable and environmental concern way. The mold residue powder with functional groups on the surface was reactive to polar resins as the results of FT-IR spectrum (FT-IR). Mechanical tests, differential scanning calorimetry (DSC), vicat softening...
This paper evaluated the influences of silica nanoparticles on the dielectric properties, mechanical performances and glass transformation behaviors of epoxy resin by analyzing the temperature dependence of dc conduction and dielectric loss, impact test results and dynamic mechanical data, respectively. The particular attention was given to the correlation between the glass transformation behaviors,...
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