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In this paper are described some principles and new methods underlying the temperature adjustment in an laboratory electrical furnace. Due to high thermal inertia, classical Proportional-Integral-Derivative algorithms are difficult to be implemented when a high precision temperature adjustment is required. An original software algorithm written in C language performs the temperature control function,...
The thermal diffusivity of silicon DSi has been used to realize fully-CMOS frequency references. However, due to the temperature dependence of Dg, the accuracy of such frequency references is limited to about 1000 ppm (−55 °C to 125 °C, one-point trim) due to the inaccuracy of the on-chip temperature compensation circuitry. As an alternative, we propose a frequency reference based on the thermal diffusivity...
Temperature distributions and effects of metal wires on thermal properties in stacked 3-D ICs are analyzed with a test structure, which has a top tier chip attached on a bottom dummy chip with adhesive layer. The top tier chips were fabricated by a standard 0.18-$ {\mu }\text{m}$ CMOS process and their thickness ${t} _{{Si}}$ was thinned down to 20 $ {\mu }\text{m}$ . The test structure consists...
Measuring the dissipated power of fast switching semiconductors or magnetic components with low power factor makes high demands on the accuracy of the measurement equipment. Calorimetric measurement methods represent a possible solution for this problem but are considered as being too time demanding. A compensating temperature control facilitates to reduce the time demand for a single measurement...
The thermal, laboratory model of multi-core microprocessor was fabricated and analyzed. It consists of four separately powered thick-film resistors. Moreover, thermoelectric temperature sensor, suitable for monitoring of small and dynamic temperature changes on the microprocessor/heat sink border, was designed and tested. It consists of two separate substrates connected by nickel and silver wires...
The paper presents a research, where modeling and experimental investigation of current density was performed in the lead-free solder joints of different surface mounted chip-size resistors. The currently presented work is based on previous research in the field, where the footprints, the interconnecting copper track on the printed circuit board and the three dimensional joint structure defined the...
We report on micro-machined flow-rate sensors as part of autonomous multi-parameter sensing devices for water network monitoring. Three different versions of the flow-rate sensors have been designed, fabricated and experimentally characterized. Those sensors are made of identical micrometric platinum resistors deposited on two different substrates-glass and silicon with and without insulation layer...
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