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Polyimides (PI) are widely used in microelectronic industries because of their outstanding characteristics such as good mechanical, thermal and dielectric properties. In this paper, a novel PI/SiO2-Al2O3 co-doped composite film was prepared. The inorganic phases of SiO2 were added to PAA solution by sol-gel method with TEOS as precursor, while the Al2O3 phase was added as particles by ultrasonic-mechanical...
The purpose of this study was to prepare a 3D nanocomposite bone substitute prepared from gelatin (GEL) and synthesized hydroxyapatite (HAP) in order to mimic natural bone feathers through a novel layer solvent casting combined freeze-drying technique. The adhesion between superimposed layers was ensured by applying a GEL solution. Furthermore, samples were cross-linked with 1% glutaraldehyde (GA)...
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