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We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules...
An optical interconnection module directly integrated on a flexible optical/electrical hybrid printed circuit board (O/E hybrid PCB) is presented. A newly proposed polymeric optical waveguide plays roles in the optical path and in a platform as an O/E hybrid PCB integrated with various optical/electrical components. The fabricated flexible O/E hybrid PCB had sufficient optical characteristics such...
As multicore architectures prevail in modern high- performance processor chip design, the communications bottleneck has begun to penetrate on-chip interconnects. With vastly growing numbers of cores and on-chip computation, a high-bandwidth, low-latency, and, perhaps most importantly, low-power communication infrastructure is critically required for next generation chip multiprocessors. Recent remarkable...
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