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The thermal cycling performance of lead free soldered ball grid arrays (BGAs) and chip size packages (CSPs) soldered with eutectic SnPb solder paste, so-called backward compatible assemblies, tends to drop with increasing Pb concentration in the joints. This is a particular concern for fine pitch CSPs where concentrations are invariably rather large. Flip chip assembly life is almost always improved...
Thermal fatigue of solder joints is critical to electronic package performance and life consideration. Failure caused by device warpage (WPG) problems is a major challenge with demands for miniaturization and system integration in a faster, better, and cheaper environment. This paper discusses a relationship between warpage and thermal fatigue life time and failure mechanism under thermal cycling...
In this paper, thermo-mechanical reliability of four different low-silver SnAgCu (SAC) lead free alloys is investigated in a harsh thermal environment of -55 to 125°C. Four configuration of test boards were assembled all having identical 100 I/O, 0.8mm pitch chip array ball grid array (CABGA) packages. Previous researchers have demonstrated the superior performance of low-silver leadfree alloys in...
This work focuses on co-design of the 1st level and 2nd level solder joint reliability analysis of a flip chip package, with large die. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate. Two 1st level solder bumps are modeled along with the 2nd level solder balls. The fatigue life of 2nd level solder joint is estimated by the...
The thermal management for FC (flip chip) on the LTCC has to be better understood, in order to meet this requirement. Therefore a DoE (design of experiment) was developed and LTCC-thickness, thermal vias, heatspreader and underfill were used as parameters. The test die has a heating resistor to simulate the power loss in the amplifier and a diode circuit. With the voltage drop over the diode, the...
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