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In recent years, the substrate which achieves low-cost manufacturing and high density wiring is strongly demanded for the next generation high performance computing. Therefore, we developed the process of micron-order wiring with printing nano-scale conductive particle. This process has two noble technologies. One is micron order trench forming and another is printing and sintering. In this time,...
An on-chip buck converter with 3D chip stacking is proposed and the operation is experimentally verified. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70mA with a switching frequency of 200MHz and a 2x2mm on-chip LC output filter in 0.35mum CMOS. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3%, and the power efficiency...
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