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The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip design innovations, including the prospect of extending emerging systems-on-chip (SoC) design paradigms based on networks-on-chip (NoC) interconnection architectures to 3D chip designs. In this paper, we consider the problem of designing application-specific 3D-NoC architectures...
The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extension of two-dimensional (2D) mesh-based tiled chip-multiprocessor architectures into three dimensions. In this paper, we focus on efficient routing algorithms for such 3D mesh networks. As in the case of 2D mesh networks, throughput...
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