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The effects of the thermal annealing temperature and time on the strain mechanisms involved in thin copper films deposited on a silicon substrate with a polyimide sublayer in between were studied by optical, atomic force and scanning electron microscopy. Thermal compressive stresses are shown to be responsible for buckling of detached film regions and for film wrinkling accompanied by coherent viscoelastic...
Image deformations caused by electromagnetic interference (EMI) are ones of the most frequent undesirable effects in practical scanning electron microscopy. They usually appear, even although the place chosen for a microscope system fulfills EMI conditions, as periodic deformation of vertical edges of an observed specimen. Available, but still very expensive methods for decreasing their influence...
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