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The solid/liquid reaction couple technique was employed to investigate the interfacial reactions between Cu-xZn (x = 0 wt.%, 5 wt.%, 15 wt.%, 30 wt.%, 40 wt.%) alloys and lead-free solders Sn, Sn-3.0Ag-0.5Cu (SAC, in wt.%), and Sn-9Zn (SZ, in wt.%) alloys at 240°C, 270°C, and 300°C for 0.5 h to 100 h. (Cu,Zn)6Sn5 and (Cu,Zn)3Sn phases were formed in the Sn/Cu-xZn (x = 5 wt.%, 15 wt.%, 30 wt.%) reaction...