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Three-dimensional integrated circuit (3D IC) technology has become a popular research topic to further enhance the integration scale as well as reduce the interconnection cost. However, the high power density and the poor heat conductivity of the internal layers of the 3-D structure result in high temperature and this becomes a critical design issue of 3D IC technology. Many heat removal methods have...
High power diode lasers went a long way from the 10 W or 20 W model of the early 90s to the 100 W, 150 W or even 200 W types of today. This was possible by improving both the efficiency of the semiconductor material by about 1/3 to 70% and the heat removal capability of the heat sinks used. We arrived at diode lasers which need 150 A or more and require a more and more refined cooling setup, especially...
In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing...
In this paper, we examine the thermal issues in 3-D ICs by system-level modeling of power dissipation and analytical and numerical modeling of deviceand package-level heat removal. We find that for comparable system performance in 2-D and 3-D ICs, 20%-25% reduction in power dissipation can be achieved by 3-D integration due to lower capacitance associated with interconnects and clock networks. If...
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