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With the strength of fine pitch, high electrical conductivity and excellent reliability, copper pillar interconnect becomes a promising alternative to traditional solder bump. However, bad surface smoothness is a severe problem and significantly affects the reliability of the bump connection. In this paper, numerical simulations on the shape evolution of copper pillar bump and the effect of bump dimension...
As the solder ball pitch of BGA packages decreases to 0.5mm↓, the conventional solder ball attach process runs into the bottle neck. The capability limit of S/B/A equipment being widely used now is attaching 0.5 mm pitch - 0.3 mm solder ball. It needs to upgrade the equipments and purchase new flux & attach tools to meet the ultra fine pitch process demand, which would require much investment...
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