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A technical challenge in fabrication of ultra-thin sensor chip (UTSC) is to keep chip integrity in debonding the ultra-thin chips from grinding facilities. This paper presents a new debonding method by utilizing a thermally decomposable polypropylene carbonate (PPC), as the temporary bonding adhesive. Because PPC can readily decompose at relatively low temperature, this method can maintain the chip...
Barnacle larvae (cyprids) explore surfaces to identify suitable settlement sites. This process is selective, and cyprids respond to numerous surface cues. To better understand the settlement process, it is desirable to simultaneously monitor both the surface exploration behavior and any close interactions with the surface. Stereoscopic 3D tracking of the cyprids provides quantitative access to surface...
3D integrated circuits (3DICs) by stacking electronic devices can increase system functionality while decreasing the overall footprint. Through silicon via (TSV) technology based on thin wafers (typically below 100 μm) has been developed to realize 3DIC stacking over the last decades. Due to their fragileness and tendency of warping, thin device wafer need to be bonded firmly to a carrier wafer during...
3D integrated circuits (3DICs) by stacking electronic devices can increase system functionality while decreasing the overall footprint. Through silicon via (TSV) technology based on thin wafers (typically below 100 μm) has been developed to realize 3DIC stacking over the last decades. Due to their fragileness and tendency of warping, thin device wafer need to be bonded firmly to a carrier wafer during...
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