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In this paper, a wafer-scale gold-to-gold thermo-compression bonding packaging based on an RF distributed MEMS transmission line (DMTL) phase shifter is proposed. The DMTL phase shifter, based on a coplanar waveguide (CPW), has symmetrical saw-shaped structures in the CPW signal line under the MEMS bridge and an insulation layer in the middle of the structures. Two Si wafers are bonded together using...